Check patentability & draft patents in minutes with Patsnap Eureka AI!

Encoding method of chip identification serial number and device thereof

A technology of chip identification and encoding method, which is applied in the field of identification serial number encoding method and its device, and can solve problems such as difficult tracking

Inactive Publication Date: 2009-12-16
SONIX TECH
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The biggest advantage of the above identification number encoding method is that it is simple to arrange, but the disadvantage is that the numbers between one batch of chips and another batch of chips (that is, the identification number) must be repeated (because they all start from 0), but the repetition rate Therefore, it is difficult to trace its source from an identification number (which batch of wafers it belongs to)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Encoding method of chip identification serial number and device thereof
  • Encoding method of chip identification serial number and device thereof
  • Encoding method of chip identification serial number and device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] Generally speaking, a wafer factory will give a wafer lot number (lotnumber) to each batch of wafers produced, and, in practice, the wafer lot numbers of each batch of wafers are not repeated at all. The same wafer lot number has a maximum of 25 slot numbers or wafer numbers. In other words, each batch of wafers has a maximum of 25 wafers. As for the number of crystal grains contained in each wafer, it depends on the size of the crystal grain itself. For example, the larger the crystal grain, the fewer the number of crystal grains. The present invention utilizes the unique "production history" of the above-mentioned wafer itself (that is, the batch number, engraving number and serial number of each die) to generate an identification number. The present invention is applicable to all non-volatile memories, including one time programmable (OTP) memories and multiple time programmable (MTP) memories.

[0012] figure 1 It is a flow chart of an embodiment of the chip ident...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an encoding method of the chip identification serial number, which uses the wafer batch number, the etched number and the flow number of the chip for encoding. Thereby, not only the repeat frequency of the identification serial number is greatly reduced, but also the tracking thereafter is facilitated. The invention further provides an encoding device for the chip identification serial number.

Description

technical field [0001] The present invention relates to a nonvolatile memory, in particular to a method for encoding an identification serial number applied to a nonvolatile memory and a device thereof. Background technique [0002] Generally speaking, when each non-volatile memory leaves the factory, an identification number will be written inside it for identification. Traditionally, the identification number is generated in the form of serial code, for example: wafer A, B, C Assuming that there are 10,000 chips each, the chip identification number in wafer A will be coded from 0 to 9999, and the chip identification number in wafer B will continue from the last number of wafer A, from 10000 to 19999. The chip identification number in wafer C is programmed from 20000 to 29999, and so on. In principle, the coding of the chip identification serial number of the next wafer is to continue the last identification serial number of the previous wafer, until the digits of the iden...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H03M7/00
Inventor 徐慧娟王宗懋郑文槟罗勉诚
Owner SONIX TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More