Semiconductor module and inverter apparatus

Abstract

Provided is a semiconductor module having a structure in which a plurality of substrates each having a switching element and a diode element thereon are arranged such that the switching element and the diode element are disposed in series in the direction in which a refrigerant flows so that the switching elements on the respective substrates can be appropriately cooled. Parallel flow generating means (8) for generating parallel flows of the refrigerant in a predetermined direction are arranged in refrigerant flow paths (7). Each substrate (3) has thereon the switching element (4) and the diode element (5) such that those elements are disposed in series in the direction (D) in which the refrigerant flows. On each substrate, the switching element (4) and a connection terminal area (6) are arranged in different positions in the direction (C) orthogonal to the refrigerant flowing direction (D). The substrates (3) of each pair are disposed in series in the refrigerant flowing direction (D). In one of the substrates (3) of each pair, the switching element (4) is arranged on one side in the orthogonal direction (C), and in the other substrate (3), the connection terminal area (6) is disposed on that same side in the orthogonal direction (C).

Description

technical field [0001] The present invention relates to a base plate; a plurality of substrates mounted on one side of the base plate and provided with switching elements, diode elements, and connection terminal regions; and a coolant flow path provided in contact with the other side of the base plate. Semiconductor modules and inverter devices. Background technique [0002] For example, in an inverter circuit for driving a high-power output motor used in a hybrid vehicle, an electric vehicle, etc., a semiconductor module provided with a switching element constituting the inverter circuit generates a large amount of heat. , is also required to be miniaturized. Therefore, as a cooling structure for semiconductor modules, a water cooling system is often used. As a configuration of such a water-cooled semiconductor module, for example, the one disclosed in the following Patent Document 1 Figure 15 composition shown. In this figure, (a) is a top view, (b) is a side view, and...

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Problems solved by technology

Therefore, there is a problem that the temperature of the coolant flowing through each coolant channel 105 gradually rises, and the cooling performance of the switching element 106 on the downstream side decreases.

[0006] In addition, the aforementioned Patent Document 1 only discloses a configuration in which the switching elements 106 and the diode elements 107 of the substrates 104 are alternately arranged in a direction perpendicular to the flow direction D of the coolant.

There is no disclosure of a configuration in which the switching elements 106 and the diode elements 107 of the substrates 104 are arranged in series in the coolant flow direction.

In addition, as far as the structure in which the switching elements 106 and the diode elements 107 of the respective substrates 104 of the semiconductor module are arranged in series in the coolant flow direction, a cooling structure for appropriately cooling these respective elements 106 and 107 has not been known.

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