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Heat-conductive silicone composition

A composition and silicone technology, applied in the direction of semiconductor devices, heat exchange materials, semiconductor/solid device components, etc., can solve the problems of automatic and mechanical application, poor flame retardancy and heat resistance, and poor production efficiency

Active Publication Date: 2010-01-13
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Since these compositions use organic materials such as waxes and modified silicone waxes in addition to silicone, their flame retardancy and heat resistance are inferior to those of silicone alone
Although grease can be applied at high production rates by automatic and mechanical means such as dispensers or screen printing, heat-softenable sheets are difficult to apply by automatic and mechanical means and have poor production rates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3 and comparative example 1-3

[0137] Preparation of Thermally Conductive Silicone Compositions

[0138] According to the formulation shown in Table 1, by adding component (C) to component (A), optionally adding component (D) and other components, feeding them into a planetary mixer, stirring and Mix at 80° C. for 30 minutes to form a uniform solution, thereby preparing a thermally conductive silicone composition. Component (B) was added to the homogeneous solution, and stirred and mixed at room temperature for 1 hour.

[0139] Application of Thermally Conductive Silicone Composition

[0140] A stainless steel (SUS) plate having a size of 3 cm x 3 cm x 120 μm was provided in the form of a metal mesh. Using a press in conjunction with a metal screen, apply the thermally conductive silicone composition to the heat sink. It was evaluated whether the composition could be applied at 25°C. The composition was rated as good (◯) when the composition could be applied uniformly over the entire surface, and poor (...

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PUM

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Abstract

A heat-conductive silicone composition comprising (A) a silicone resin, (B) a heat-conductive filler, and (C) a volatile solvent is disposed between a heat-generating electronic part and a heat sink part. It is a grease-like composition at room temperature prior to application to the electronic or heat sink part. It becomes a non-flowable composition as the solvent volatilizes off after application, and this composition, when heated during operation of the electronic part, reduces its viscosity, softens or melts so that it may fill in between the electronic and heat sink parts.

Description

technical field [0001] The present invention relates to a thermally conductive silicone composition disposed at a thermal interface between a heat-generating electronic component and a heat-dissipating component, such as a heat sink or a metal case for cooling the electronic component. More particularly, the present invention relates to thermally conductive silicone compositions that are flowable at temperatures within the operating temperature range of electronic components to enhance adhesion to thermal interfaces for improved transfer from electronic components to heat sink components. hot. Background technique [0002] The circuit design of modern electrical equipment, such as televisions, DVD displays, computers, medical instruments, business machines, communication equipment, etc., has become increasingly complex. For example, integrated circuits are manufactured for these and other devices containing tens of thousands of transistors. Despite the desire for smaller s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06H01L23/373
CPCC09K5/14
Inventor 远藤晃洋
Owner SHIN ETSU CHEM IND CO LTD