Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Device for taking and putting crystalline grain and method thereof

A technology of grain and predetermined position, which is applied in the direction of transportation and packaging, conveyor objects, etc., can solve the problems of inability to adjust, different sizes, etc., and achieve the effects of avoiding damage to grains, simplifying assembly methods, and reducing production costs

Active Publication Date: 2010-01-27
MICROELECTRONICS TECH INC
View PDF2 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As previously mentioned, each crystal grain 30 is different in size except that the height is different, and the larger crystal grain 30 needs a greater downward pressure strength to maintain the stability of the crystal grain 30 when it is pushed up by the thimble 36, but it has The downforce provided by the die picker is fixed and cannot be adjusted accordingly in each step
[0006] Therefore, there are above-mentioned inconveniences and problems in the known crystal grain pick-and-place device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device for taking and putting crystalline grain and method thereof
  • Device for taking and putting crystalline grain and method thereof
  • Device for taking and putting crystalline grain and method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0067] The present invention will be further described below in conjunction with embodiment and accompanying drawing.

[0068] see now Figure 5 and Figure 6 , Figure 5 It is a schematic diagram of an embodiment of the present invention, Figure 6 for Figure 5 Example working schematic. As shown in the figure, the displacement control device 40 is connected to a swing arm 42, the front end of the swing arm 42 is equipped with a suction head 44, and the displacement control device 40 controls the vertical movement of the swing arm 42 so that the suction head 44 descends on the crystal. Grain 46 on. In this embodiment, the displacement control device 40 controls the movement of the swing arm 42 in at least two stages. When picking up the crystal grain 46, first operate in the first stage mode, such as point-to-point displacement control, let the suction head 44 drop to a certain distance above the crystal grain 46 at a faster speed, and then enter the second stage mode,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a device for taking and putting crystalline grain, comprising a swinging arm and a move controlling device. The device is characterized in that the front end of the swinging arm is provided with an absorption head; the move controlling device is connected with the end of the swinging arm to control the swinging arm to be perpendicularly move; and the move controlling device provides an upward force for the swinging arm to reduce force applied to the crystalline grain when controlling the swinging arm to descend. The device for taking and putting the crystalline grain has the advantages of preventing the absorption head from damaging, fast and exact swinging move, and reducing manufacture cost.

Description

technical field [0001] The invention relates to a device and a method used in a semiconductor manufacturing process, in particular to a device and a method for picking and placing crystal grains. Background technique [0002] The testing and sorting of crystal grains is a necessary process in the semiconductor production process. Taking the production of light-emitting diodes (LEDs) as an example, the LED grains produced after wafer cutting are tested by a detector (prober), and each crystal grain is obtained. After analyzing the characteristics of the grains, such as dominant wavelength, luminous intensity, luminous flux, color temperature, operating voltage, reverse breakdown voltage and other parameters, each grain is divided into several grades for shipment. During this sorting process, the grain pick-and-place device picks up the grains one by one and distributes them into collection boxes (bins) of various levels. [0003] figure 1 It is a schematic diagram of a know...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
Inventor 徐嘉彬洪嘉宏刘景男张志荣
Owner MICROELECTRONICS TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com