Electroforming method and electroforming apparatus commonly acted by ultrasonic wave and laser

Abstract

The invention relates to an electroforming method and electroforming apparatus commonly acted by ultrasonic wave and laser, wherein the electroforming method comprises: applying ultrasonic wave and laser wave simultaneously in the electroforming solution of the same zone close to the raw mould. The ultrasonic wave breaks the metal ion groups in the electroforming solution continuously so that thecasting film has good compactness and fine grain. Simultaneously, two different waves of ultrasonic wave and laser wave are commonly acted to the electroforming solution, so the common action zone ofthe two waves will produce polymerization of two energies, and novel acousto-optic property is produced, and activity of the electroforming metal ions is enlarged to facilitate the deposition of electroforming metal ions and evenness of the deposition layer. Simultaneously, the laser wave can accelerate collapse of the cavitation bubbles, thereby enhancing the cavitation effect; the cavitation bubbles produced by the ultrasonic wave produce reflection and refraction to the laser so that the laser that is transmitted in line is changed the light path, thereby increasing the acted point site, and improving the electroforming speed.

Description

technical field [0001] The invention relates to an electroforming method and an electroforming device utilizing ultrasonic waves and lasers acting together, belonging to the technical field of electroforming. Background technique [0002] With the rapid development of science and technology and modern industry, the structure and shape design of industrial products are becoming more and more complex, and the requirements for machining accuracy are becoming higher and higher, and many new structures, new materials and parts with complex shapes have appeared , so it is necessary to process various difficult-to-cut materials, special complex profiles, ultra-precision and smooth parts or other special parts. To solve these processing problems, it is difficult to achieve only by traditional processing methods. At present, there are many special processing technologies, and the precision processing and ultra-precision processing of special parts can be realized by using their spec...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide an electroforming method utilizing ultrasonic waves and lasers to act together, and also to provide an electroforming device utilizing ultrasonic waves and lasers acting together to solve the problem of the outer surface of the electroforming layer existing in existing electroforming There are problems of pinholes, nodules, uneven thickness, slow electroforming speed, and poor material properties

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