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Plating layer for electrochemistry corrosion resistant electronic encapsulation shell

An electronic packaging and electrochemical technology, applied in the direction of circuits, coatings, electrical components, etc., can solve the problems of glass easy to fall off, corrosion, base metal exposure, etc., and achieve the effect of meeting the requirements of oxidizability

Inactive Publication Date: 2010-02-17
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the plating layer of the existing electronic packaging shell is nickel-plated first and then gold-plated, the standard electrode potential of gold is +1.68V, while that of nickel is -0.25V, and that of Fe is -0.441V. The kinetic potential difference of primary battery corrosion is very large. Under normal circumstances, the electroplating layer always has certain pores, so the corrosion reaction of the primary battery is easy to occur
The main reason for the corrosion and fracture of the root of the lead wire is that there is a thin layer of glass climbing up at the sealing interface between the lead wire and the glass. If an external force is encountered after electroplating, this layer of glass is easy to fall off, resulting in the exposure of the base metal, and there are certain coating defects at the glass interface. , Corrosion and fracture in salt gas
The casing itself is also heavily corroded.

Method used

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  • Plating layer for electrochemistry corrosion resistant electronic encapsulation shell

Examples

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Effect test

Embodiment 1

[0014] See attached picture.

[0015] It is used for the coating of the electronic package housing to resist electrochemical corrosion. The surface layer of the housing base 1 and the surface layer of the lead wire 7 are sequentially plated with an inert metal layer 5, an iron-nickel layer 6, a nickel layer 2 and a gold layer 4 from the inside to the outside. The weight percent of iron in the iron-nickel layer 6 is 15%. Both the lead wire 7 and the housing base 1 are pre-plated with an inert metal layer 5 before sintering the frit glass layer 3. The inert metal can be selected from gold, silver, copper, etc. to form a high potential barrier layer at the bottom. The iron-nickel layer 6 is pre-plated again, and the iron-nickel layer 6 can play a sacrificial corrosion effect in salt spray corrosion, thereby effectively protecting the body material; the weight percentage of the iron-nickel layer 6 iron is 15%, and the coating and Kovar The composition is basically the same, which...

Embodiment 2

[0017] It is used for the coating of the electronic package housing to resist electrochemical corrosion. The surface layer of the housing substrate 1 and the surface layer of the lead wire 7 are sequentially plated with an iron-nickel layer 6, a nickel-plated layer 2 and a gold-plated layer 4 from the inside to the outside, and the iron-nickel layer 6 is iron. The weight percentage is 15%. The iron-nickel alloy layer 6 can play a sacrificial corrosion role in salt spray corrosion, thereby effectively protecting the body material; the weight percentage of the iron-nickel layer 6 iron is 15%, and the composition of the coating is basically the same as that of Kovar alloy, which meets the matching requirements. The basic requirements for permanent sealing and meet the oxidizable requirements of the substrate surface.

Embodiment 3

[0019] It is used for the coating of the electronic package housing to resist electrochemical corrosion. The surface layer of the housing base 1 and the surface layer of the lead wire 7 are sequentially plated with an inert metal layer 5, an iron-nickel layer 6, a nickel layer 2 and a gold layer 4 from the inside to the outside. The weight percent of iron in the iron-nickel layer 6 is 65%. All the other are with embodiment 1.

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Abstract

The invention relates to a plating layer for an electrochemistry corrosion resistant electronic encapsulation shell, which comprises the following step: sequentially plating an inert metal-plating layer, a ferronickel-plating layer, a nickel-plating layer and a gold-plating layer on a surface layer of a shell matrix and a surface layer of a lead from the inner part to the outer part, wherein the ferric content of the ferronickel-plating layer is from 15 to 65 percent by weight. The invention can prevent and retard the electrochemistry corrosion of the electronic encapsulation shell.

Description

technical field [0001] The invention relates to a coating structure for anti-corrosion of shells. Background technique [0002] The salt spray corrosion mechanism belongs to the galvanic battery reaction, that is, there are reaction medium, reaction electrodes and channels, and corrosion will occur. Since the plating layer of the existing electronic packaging shell is nickel-plated first and then gold-plated, the standard electrode potential of gold is +1.68V, while that of nickel is -0.25V, and that of Fe is -0.441V. The kinetic potential difference of primary battery corrosion is very large. Usually, the electroplating layer always has certain pores, so the corrosion reaction of the primary battery is easy to occur. The main reason for the corrosion and fracture of the root of the lead wire is that there is a thin layer of glass climbing up at the sealing interface between the lead wire and the glass. If an external force is encountered after electroplating, this layer of...

Claims

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Application Information

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IPC IPC(8): C23C30/00H01L21/56
Inventor 徐东升
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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