Making process of circuit board with radiation fins
A manufacturing process and technology of heat sinks, which are used in printed circuit manufacturing, cooling/ventilation/heating transformation, printed circuits, etc. Performance and appearance effects
Active Publication Date: 2011-05-04
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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Problems solved by technology
According to the traditional screen printing method, it is impossible to completely print the surface ink on the surface of the heat sink with a thickness of 8mil, because the thickness of the ink at the corners of the heat sink is difficult to guarantee under this thickness, the ink thickness is less than 5μm or the copper surface is completely exposed
It will cause the exposed copper on the surface to oxidize or the short circuit of electronic components caused by tin on the component mounting process
Method used
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Embodiment
[0013] A manufacturing process for a circuit board with a heat sink, which includes lamination and silk screen printing processes, wherein the lamination process includes the lamination step of pressing the heat sink to the PCB board, and the silk screen process includes the steps of oiling, silk screen printing and curing, wherein In the silk screen printing process, the copper edge of the heat sink is screen-printed first, preheated, and then the copper surface of the heat sink is screen-printed, and then preheated. 0.2-0.5Mpa, the viscosity of the ink is 500-600dps when printing the copper edge of the heat sink, preheat at 80°C for 20 minutes, and the ink viscosity is 300-450dps when printing the surface of the heat sink copper sheet, preheat at 70°C for 20 minutes, and cure The curing condition in the step is to bake at 100° C. for 30 minutes, then rise to 130° C. and bake for 40 minutes.
[0014] In the pressing step, the pressing pressure is 1.2±0.5Mpa, and the pressing ...
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The invention discloses a making process of a circuit board with radiation fins, comprising pressing procedure and screen printing procedure, wherein the pressing procedure comprises the step of pressing the radiation fins to a PCB and the screen printing procedure comprises oil drilling step, screen printing step and curing step, wherein the screen printing step comprises the procedures of the screen printing of the edges of copper sheets of the radiation fins, the preheating of the copper sheet edges, then the screen printing of the surfaces of the copper sheets of the radiation fins and the preheating. The making process has the advantages that the made PCB is pressed with the radiation fins, printing ink is uniformly covered on the surfaces of the radiation fins and the circuit board has good electric performance and appearance.
Description
technical field [0001] The invention relates to a circuit board manufacturing process, in particular to a circuit board manufacturing process with cooling fins. Background technique [0002] At present, one of the development directions of electronic equipment is to develop towards ultra-thin and ultra-miniature, so large-scale integrated circuits and other electronic accessories tend to be more and more integrated, the circuit density is getting higher and higher, and the reliability requirements are lower. It is getting higher and higher, and the power of components is getting bigger and bigger, and it promotes the continuous upgrading of equipment functions. The resulting problem is the need to improve the cooling technology accordingly. In the case of a certain circuit structure and component form, mounting a heat sink on the surface of the circuit board can effectively improve the heat dissipation effect of the component. [0003] The heat sink is also called heat sin...
Claims
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IPC IPC(8): H05K3/00H05K7/20
Inventor 姜文东邹凌乾
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD