Spacer used between liquid crystal substrates and packaging structure with same

A technology of liquid crystal substrate and packaging structure, applied in the field of gasket structure, can solve the problems of crushing the lower substrate, sticking liquid crystal substrate, mechanical failure, etc., and achieves the effect of improving the sticking problem and reducing the crushing of the lower layer.

Inactive Publication Date: 2010-03-03
AU OPTRONICS CORP
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing spacer is generally designed as a planar structure, which is not only easy to stick to the liquid crystal substrate, but also may damage the underlying substrate
In addition, if these packaged liquid crystal substrates are applied to an automated production line for operation, there may be mechanical failure due to the adhesion between the gasket and the substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Spacer used between liquid crystal substrates and packaging structure with same
  • Spacer used between liquid crystal substrates and packaging structure with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The specific implementation manners of the present invention will be described in further detail below with reference to the accompanying drawings.

[0019] figure 1 A schematic diagram of a buffer element used between liquid crystal substrates in the prior art is shown. refer to figure 1 , the packaging structure includes: a substrate pair 40 with an upper substrate 41 and a lower substrate 42 , a plurality of grooves 411 on the substrate 41 , positioning holes 422 on the substrate 42 and concave portions 421 and 423 . Wherein, between the upper substrate 41 and the lower substrate 42, a planar buffer element made of polymer material is interposed. In addition, the outer edge of the polymer buffer element is connected to the glass substrate to absorb the force acting on the glass substrate due to external vibrations, thereby reducing packaging costs and preventing damage to the glass substrate without damaging the glass substrate. The short-circuit failure of the ci...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a damping spacer used between liquid crystal substrates. Specifically, the spacer is embedded between the upper liquid crystal substrate and the lower liquid crystal substrate,has lattice distribution shape and is provided with a plurality of serrated prominences respectively along the direction of x axis and the direction of y axis. The serrated prominences have height difference in the direction x axis and the direction of y axis. The invention also provides a packaging structure containing the spacer. Being adopted, the spacer and the packaging structure of the invention can not only reduce the probability of crushing the lower liquid crystal substrate but also form an airflow circulation loop by employing the height difference of the serrated prominences of thespacer and improve the problem of sticking between the spacer and the liquid crystal substrates due to the adsorption effect.

Description

technical field [0001] The invention relates to a spacer structure, in particular to a spacer structure used between liquid crystal substrates to bear and buffer force. Background technique [0002] At present, when packaging liquid crystal substrates, in order to prevent electrostatic induction caused by friction between the substrates and substrates to cause short-circuit faults and fogging on the surface of the glass substrate, a spacer is usually inserted between the liquid crystal substrates. Using this gasket, you can The separation of the upper substrate from the lower substrate can also protect the respective circuits of the upper and lower substrates from being damaged. [0003] However, the existing spacer is generally designed as a planar structure, which is not only easy to stick to the liquid crystal substrate, but also may damage the underlying substrate. In addition, if these packaged liquid crystal substrates are applied to an automated production line for o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B65D57/00B65D85/30
Inventor 张文元谢坤宏苏宏积杨敏政吴郡翔
Owner AU OPTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap