Spacer used between liquid crystal substrates and packaging structure with same

Abstract

The invention provides a damping spacer used between liquid crystal substrates. Specifically, the spacer is embedded between the upper liquid crystal substrate and the lower liquid crystal substrate,has lattice distribution shape and is provided with a plurality of serrated prominences respectively along the direction of x axis and the direction of y axis. The serrated prominences have height difference in the direction x axis and the direction of y axis. The invention also provides a packaging structure containing the spacer. Being adopted, the spacer and the packaging structure of the invention can not only reduce the probability of crushing the lower liquid crystal substrate but also form an airflow circulation loop by employing the height difference of the serrated prominences of thespacer and improve the problem of sticking between the spacer and the liquid crystal substrates due to the adsorption effect.

Description

technical field

[0001] The invention relates to a spacer structure, in particular to a spacer structure used between liquid crystal substrates to bear and buffer force. Background technique

[0002] At present, when packaging liquid crystal substrates, in order to prevent electrostatic induction caused by friction between the substrates and substrates to cause short-circuit faults and fogging on the surface of the glass substrate, a spacer is usually inserted between the liquid crystal substrates. Using this gasket, you can The separation of the upper substrate from the lower substrate can also protect the respective circuits of the upper and lower substrates from being damaged.

[0003] However, the existing spacer is generally designed as a planar structure, which is not only easy to stick to the liquid crystal substrate, but also may damage the underlying substrate. In addition, if these packaged liquid crystal substrates are applied to an automated production line for o...

Examples

Embodiment Construction

[0018] The specific implementation manners of the present invention will be described in further detail below with reference to the accompanying drawings.

[0019] figure 1 A schematic diagram of a buffer element used between liquid crystal substrates in the prior art is shown. refer to figure 1 , the packaging structure includes: a substrate pair 40 with an upper substrate 41 and a lower substrate 42 , a plurality of grooves 411 on the substrate 41 , positioning holes 422 on the substrate 42 and concave portions 421 and 423 . Wherein, between the upper substrate 41 and the lower substrate 42, a planar buffer element made of polymer material is interposed. In addition, the outer edge of the polymer buffer element is connected to the glass substrate to absorb the force acting on the glass substrate due to external vibrations, thereby reducing packaging costs and preventing damage to the glass substrate without damaging the glass substrate. The short-circuit failure of the ci...

technical field

[0001] The invention relates to a spacer structure, in particular to a spacer structure used between liquid crystal substrates to bear and buffer force. Background technique

[0002] At present, when packaging liquid crystal substrates, in order to prevent electrostatic induction caused by friction between the substrates and substrates to cause short-circuit faults and fogging on the surface of the glass substrate, a spacer is usually inserted between the liquid crystal substrates. Using this gasket, you can The separation of the upper substrate from the lower substrate can also protect the respective circuits of the upper and lower substrates from being damaged.

[0003] However, the existing spacer is generally designed as a planar structure, which is not only easy to stick to the liquid crystal substrate, but also may damage the underlying substrate. In addition, if these packaged liquid crystal substrates are applied to an automated production line for o...

Examples

Embodiment Construction

[0018] The specific implementation manners of the present invention will be described in further detail below with reference to the accompanying drawings.

[0019] figure 1 A schematic diagram of a buffer element used between liquid crystal substrates in the prior art is shown. refer to figure 1 , the packaging structure includes: a substrate pair 40 with an upper substrate 41 and a lower substrate 42 , a plurality of grooves 411 on the substrate 41 , positioning holes 422 on the substrate 42 and concave portions 421 and 423 . Wherein, between the upper substrate 41 and the lower substrate 42, a planar buffer element made of polymer material is interposed. In addition, the outer edge of the polymer buffer element is connected to the glass substrate to absorb the force acting on the glass substrate due to external vibrations, thereby reducing packaging costs and preventing damage to the glass substrate without damaging the glass substrate. The short-circuit failure of the ci...

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