Heat dissipation system of heating modules

A technology of heat dissipation system and heat dissipation module, applied in cooling/ventilation/heating transformation, electrical components, magnetic field/electric field shielding, etc., can solve problems such as restricting diversity and lightness, restricting material selection and shape structure, increasing weight and volume, etc. , to achieve the effect of compact structure, good heat dissipation effect and shielding electromagnetic radiation

Inactive Publication Date: 2010-03-10
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, there are holes for other buttons, display lights, etc., which cannot achieve real shielding, and electromagnetic leakage will inevitably occur. In addition, because the box body needs to shield electromagnetic radiation, it must be made of metal, which greatly limits its material selection and shape. , and even increase the weight and volume, which seriously restricts the development towards diversity and lightweight

Method used

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  • Heat dissipation system of heating modules
  • Heat dissipation system of heating modules
  • Heat dissipation system of heating modules

Examples

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Embodiment Construction

[0019] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0020] The technical basis and characteristics of the cooling system of the heating module of the present invention are as follows:

[0021] see figure 1 , is a schematic layout diagram of an embodiment of a heat dissipation system of a heat generating module of the present invention. As shown in the figure, A, B, C, and D are four heating modules 14 respectively. Two heating modules 14 are alternately placed on the front and back of the circui...

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Abstract

The invention provides a heat dissipation system of heating modules, wherein the plurality of heating modules are respectively fixed on the two sides of a circuit board; and two heat dissipation modules are respectively covered on the surfaces of the heating modules at the two sides of the circuit board and lead the plurality of heating modules and the circuit board to be clamped and fixed betweenthe two heat dissipation modules, so that a sandwich structure is formed. The heat dissipation system has compact structure, large heat dissipation area and good heat dissipation effect, and can effectively shield electromagnetic radiation.

Description

technical field [0001] The invention relates to a cooling system of a heating module, in particular to a cooling system of a heating module capable of effectively reducing electromagnetic radiation. Background technique [0002] The development of electrical appliances is obvious to all, and with the extensive use of electrical appliances in life and production, the negative impacts have gradually attracted people's attention. For example, every electrical device needs to be driven by electricity. Therefore, the power supply brings people The negative impact is particularly important. [0003] In various electrical equipment, such as various subsystems of a photolithography machine, the power supply is the energy source of each system, and the processing of the power supply module is particularly important. The power module provides stable voltage and current for the next-level module to drive the normal operation of the next-level module. The power supply itself often has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K9/00
Inventor 周权雷艳飞吴仁玉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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