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LED packaging structure

A technology of LED packaging and LED chips, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., and can solve problems such as heat dissipation

Inactive Publication Date: 2010-04-07
张洪彬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the deficiencies of the existing LED packaging, the present invention provides a LED packaging structure with a simple structure, which can effectively solve the problem of heat dissipation when the LED is working

Method used

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Embodiment Construction

[0010] figure 1 Among them, the LED chip (4) and the lead frame (8) are connected by a heat-conducting material, which is composed of a mixture of good heat-conducting ceramic powder and silica gel (silicone oil), and the outer part of the lead frame (8) is lower than the top of the lead frame (5) And pin (9) is also wrapped by the material that good thermal conductivity ceramic powder and silica gel (silicone oil) mix to form. Among them, the ceramic powder with good thermal conductivity can be magnesium oxide, aluminum oxide, and their mixtures, or other ceramic powders with good thermal conductivity. In this way, since the material composed of good heat-conducting ceramic powder and silica gel (silicone oil) has good thermal conductivity, the heat generated by the LED chip (4) during operation can be transmitted to the outside in time. The problem of heat dissipation when the LED chip (4) is working is effectively solved. The part higher than the chip is encapsulated by t...

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PUM

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Abstract

The invention relates to an LED packaging structure in which conductive material is connected with an LED chip and a pin frame. The LED packaging structure is characterized in that the conductive material used for connecting the LED chip and the pin frame is prepared by mixing ceramic powder with good thermal conductivity and silica gel (silicone oil), and the part outside the pin frame which is lower than the chip is coated with the material prepared from the mixture of the ceramic powder with good thermal conductivity and silica gel (silicone oil). Therefore, as the thermal conductivity of the material prepared from the mixture of the ceramic powder with good thermal conductivity and silica gel (silicone oil) is good, the heat energy generated by the LED chip can be instantly dissipated to the outside so as to effectively solve the at dissipation problem of the LED chip in use.

Description

technical field [0001] The invention relates to an LED packaging structure. Background technique [0002] As a new type of light source, LED has achieved unprecedented development due to its unparalleled advantages such as energy saving, environmental protection, long life, fast start-up speed, and ability to control the light spectrum. With the increase of LED current intensity and light emission, the calorific value of LED chips also increases. For high-power LEDs, 80% of the input energy is consumed in the form of heat. If the heat cannot be discharged to the outside in time, it will cause the temperature rise effect of the chip, and the lifespan and light output of the LED will be greatly reduced. The existing LED packages basically use resin, which has a poor heat dissipation effect, especially the heat dissipation effect used on high-power LEDs cannot meet the requirements, which will reduce the light efficiency and life of the LED. Contents of the invention [000...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L23/373
CPCH01L2924/0002H01L2224/48091H01L2224/49113H01L2224/48247
Inventor 张洪彬
Owner 张洪彬