Electronic gun cover plate assembling mold and assembling method

Abstract

The invention relates to a welding mold and a welding method thereof, in particular to a special mold and technology for welding electronic gun cover plate welding. The electronic gun cover plate assembling mold comprises a positioning plate, a fixing screw, solders, a cover mold and a solder ring, wherein a groove is arranged in the positioning plate; the lower end of a lead electrode of the electronic gun is arranged in the groove; the inner wall of the groove of the positioning plate is provided with a screw hole; the fixing screw penetrates through the screw hole to fix the lead electrode; the electronic gun cover plate is sleeved on the positioning plate; the solders are added to the connecting part of the upper end of the electronic gun cover plate and the lead electrode, the solder ring is arranged on the upper end of a ceramic sealing element of the lead electrode, the cover mold is sleeved outside the ceramic sealing element of the lead electrode, and the solders are added on the solder ring. The electronic gun cover plate welded and formed by the welding mold has the advantages that the ceramic sealing element has the characteristics of good tensile strength, favorable pressure resistance and high thermal shock property, the requirements of important technical indexes on the centrad of the accelerating tube electronic source optical system, the effective emission surface distance of the cathode, and the like are satisfied, the technology uniformity is good, and the finished product rate is high.

Description

technical field [0001] The invention relates to a welding mold and a welding method thereof, in particular to a special module for welding an electron gun cover plate and a welding process. Background technique [0002] In the processing of electron guns, the welding process of insulating porcelain parts is indispensable. The welding process is complicated and requires high technology. In the prior art, there are many production methods for this product. The metallized coating on the sealing surface is also obtained in different ways. Generally, there are high-temperature molybdenum-manganese methods, through metal ion sputtering, vacuum coating, etc., and there are also active methods, each with its own characteristics and application objects; high-temperature molybdenum-manganese methods and active methods are also commonly used. However, in actual production, the tensile strength of the electron gun cover plate structural parts formed by these methods is not enough, the v...

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Problems solved by technology

[0004] The invention provides an electron gun cover plate assembly mold and assembly process, which solves the above-mentioned problems of low tensile strength of the gun cover plate structural parts, low matching rate of geometric dimensions, low forming rate, etc.

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