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Transferring unit for cutting apparatus, cutting apparatus and method of cutting using the same

A transmission unit, cutting device technology, applied in the direction of glass cutting device, glass manufacturing equipment, glass production, etc.

Active Publication Date: 2013-04-24
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the narrowing of the adhesive component of the sealing layer and the narrowing of the width of the fragment part, a breaking failure occurs, and the fragment part and the basic cell part cannot be cut off from each other.

Method used

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  • Transferring unit for cutting apparatus, cutting apparatus and method of cutting using the same
  • Transferring unit for cutting apparatus, cutting apparatus and method of cutting using the same
  • Transferring unit for cutting apparatus, cutting apparatus and method of cutting using the same

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Embodiment Construction

[0044] refer to figure 1 and figure 2 , the mother substrate assembly 100 to be cut includes a first mother substrate 110 and a second mother substrate 120 , and the first mother substrate 110 and the second mother substrate 120 are combined to face each other to form a plurality of basic unit cells UC. Each basic unit UC forms a liquid crystal display panel, and the plurality of basic units UC are arranged in a matrix form. Each basic unit cell UC may include an array layer 130 formed on the first mother substrate 110, a color filter layer 140 formed on the second mother substrate 120, sandwiched between the array layer 130 and the The liquid crystal layer 150 between the color filter layers 140 , and the sealing layer 160 for filling the liquid crystal layer 150 between the array layer 130 and the color filter layer 140 . The sealing layer 160 surrounds the liquid crystal layer 150 to combine the first mother substrate 110 and the second mother substrate 120 with each ot...

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Abstract

PURPOSE: A transfer unit for cutting device is provided to improve breaking efficiency and productivity by receiving an object to be cut and performing breaking process at the same time. CONSTITUTION: A transfer unit(420) for cutting device comprises: unit body(421); at least two receiving units(422,423,424,425) which receives a specific part from the object and transfers. The receiving unit an adsorption unit(422a,423a,424a,425a) for vacuum adsorption and pressurizing unit(422b,423b,424b,425b) which pressurizes in an opposite direction with the adsorption direction.

Description

technical field [0001] The present invention relates to a cutting device used in the manufacture of flat display panels, and more specifically, to a transfer unit for a cutting device for cutting a mother substrate for a flat display panel, a cutting device having the transfer unit, and a cutting device using the cutting device. method. Background technique [0002] In general, a flat panel display panel for displaying images such as a liquid crystal display panel uses a mother substrate, which is a large panel, and a plurality of panels are manufactured at a time. Specifically, the flat display panel has an upper substrate and a lower substrate facing each other. The upper substrate and the lower substrate are formed by separate mother substrates (a mother substrate for the upper substrate and a mother substrate for the lower substrate). The mother substrate for the upper substrate and the mother substrate for the lower substrate are respectively divided into a plurality ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/07
CPCY02P40/57
Inventor 金民雄梁真赫
Owner SEMES CO LTD