Halogen-free fire-retarding reinforced polyamide composition and molded product prepared by using same

Abstract

The invention discloses a halogen-free fire-retarding reinforced polyamide composition and a molded product prepared by using the same. The hlogen-free fire-retarding reinforced polyamide composition comprises the following components: 35 to 70 weight percent of semi-aromatic polyamide resin, 10 to 35 weight percent of fire retardant, 0 to 5 weight percent of fire-retarding synergist, 15 to 50 weight percent of inorganic reinforcing filler, at least one antioxidant and at least one inorganic nano material, wherein the total weight of the components is 100 percent. The halogen-free fire-retarding reinforced polyamide composition prepared according to the formula of the invention has high color stability, is applicable to electronic connectors that can be used in all kinds of electronic equipment such as computers, televisions, mobile phones, industrial instruments and meters and other electronic circuit board devices.

Description

technical field [0001] The present invention relates to a polyamide composition. Background technique [0002] Polyamide resin has excellent mechanical strength, heat resistance, chemical resistance, wear resistance and self-lubrication, and has a low coefficient of friction. Its wide application fields include electronic appliances, automobile parts, furniture, building materials and fibers. Become one of the most important engineering plastics. Materials used for automotive parts and electrical and electronic components require excellent heat resistance, formability, and low water absorption, so it is necessary to use various aromatic polyamides with high heat resistance and low water absorption. [0003] In recent years, from the viewpoint of environmental protection, lead-free solder for surface mounting has been developed as a method for high-density mounting. Lead-free solders tend to have higher reflow temperatures than the lead and tin eutectic solders widely used ...

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Problems solved by technology

[0009] The applicant has tried the effect of the compound stabilizer described in patent US5380774A and patent EP1950238 on the halogen-free flame-retardant semi-aromatic polyamide composition. The color stability of the polyamide composition system is relatively poor, and the method described in the patent EP1950238 has improved color stability compared with the method described in the patent US5380774A, but the color change is still relatively obvious in the high temperature resistance test

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