68results about How to "High preparation precision" patented technology

The invention discloses a touch display screen and a manufacture method thereof, relating to the field of liquid crystal display and solving the technical problems of high manufacture cost because two screens need to be manufactured for the touch display screen. The touch display screen comprises a color film substrate and an array substrate arranged corresponding to the color film substrate, wherein the color film substrate comprises an upper substrate and a common electrode formed on the upper substrate; the array substrate comprises a lower substrate and a grid line, a data link and a pixel electrode which are formed on the lower substrate; the common electrode is provided with a plurality of spacers which butt against the grid line or the data link and enables the common electrode to be respectively electrically conducted with the grid line and the data line under the action of pressure; the touch display screen also comprises a voltage detection circuit; the voltage detection circuit is connected with the grid line and the data line and is used for detecting whether voltages on the grid line and the data line are equal to the voltage of the common electrode or not. The invention is applied to the touch display screen of a liquid crystal display.

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a substrate. The substrate comprises a display area and a non-display area surrounding the display area. The non-display area is provided with a retaining wall, and the retaining wall surrounds the display area. The display area is provided with a planarization layer, a pixel definition layer and supporting columns. The pixel definition layer is arranged on one side, far away from the substrate, of the planarization layer. The supporting columns are arranged on one side, far away from the substrate, of the pixel definition layer. The retaining wall, the supporting columns and at least one layer of the pixel definition layer and the planarization layer are made of the same material. According to the scheme of the embodiment of the invention, the preparation precision of the retaining wall is improved. The blocking effect of the retaining wall on a thin film packaging layer is ensured, and the frame of the display panel is reduced.

The present invention discloses an ultra-thick 5G antenna PCB module processing method. The method comprises the following steps: (1) manufacturing a top layer part; (2) manufacturing a bottom layer part; and (3) manufacturing a finished product. The manufacture of the top layer part and the manufacture of the bottom layer part both comprise cutting, plate material processing and plate material pressing. According to the method, by optimizing the structure and the preparation process of an ultra-thick 5G antenna PCB module, the process difficulty is reduced, the machinable plate thickness reaches to 7-12 mm, the circuit, electroplating and etching requirement(s) of an ultra-thick plate can be effectively satisfied by using a conventional device, the preparation precision of the product isimproved, so that the shape deviation of the finished product is small, and thus the yield rate of the product is improved.

The invention discloses an automatic grouting production system. The automatic grouting production system comprises a control system, a grout making station, a grout conveying system, grout proportionstations and grouting monitoring systems. The automatic grouting production system has the advantages that the automation degree is high, the labor cost is saved, the operation is simple, the unmanned production or the flexible manpower line is realized, the proportion precision is improved, and the labor intensity is reduced.

The invention provides a polishing, grinding and tapering integrated device and method for preparing D-type and conical optical fibers. The device comprises a platform main body, a lifting module, anoptical fiber polishing and grinding module, an optical fiber transmission module, a clamp module, an optical fiber heating module and the an optical fiber. The first end of the lifting module is fixedly connected with the lower end of the platform main body; the second end of the lifting module is fixedly connected with the optical fiber polishing and grinding module; the optical fiber polishingand grinding module, the optical fiber transmission module, the real-time monitoring module and the optical fiber heating module are located at the upper end of the platform main body. The optical fiber transmission module and the optical fiber heating module are both located between the optical fiber polishing and grinding module and the real-time monitoring module; a central control and communication module is located on one side face of the platform main body, a clamp module is located on the optical fiber transmission module, and the two ends of the optical fiber are fixedly connected withgrooves of flange sliding blocks through optical fiber fixing clamps respectively. Through the design of the flange sliding blocks, the problem of relative movement of the optical fiber and a polishing and grinding wheel is ingeniously solved, and side polishing and grinding of the optical fiber and tapering of the optical fiber can be implemented.

The invention relates to an LED (light emitting diode) photonic crystal containing a left-handed material and a preparation method. The LED photonic crystal is characterized in that (1), the photonic crystal is formed by arraying a right-handed material and the left-handed material alternately; (2), gaps in a left-handed material layer are in Swiss cross structures, can be arrayed rectangularly or triangularly, and are filled with weak conducting materials; (3), a substrate of the photonic crystal is made of conducting metal; and (4), the thickness of a quantum barrier GaN between the photonic crystal and an active layer is less than 40nm. According to the LED photonic crystal and the preparation method, the LED photonic crystal is prepared by combining higher-accuracy technologies such as electron beam etching, electron beam evaporation, PECVD (plasma enhanced chemical vapor deposition), and dry etching, so that a surface plasmon enhancement effect can be generated to couple out an evanescent wave in the active layer, and wider photonic band gaps can be generated; the luminous wavelength and a light emitting angle are controlled better; and the luminous efficiency and the light emitting power of an LED are improved and increased.

The invention relates to a sound wave reflection regulation and control device based on an acoustic metasurface. The device is formed by combining a channel, a plurality of cavities which are sequentially arranged at equal intervals and a reflection plate. The reflection plate is arranged at one ends of the cavities. The device provided by the invention has very high reflectivity and a simple structure, and can be used for printing a structure by 3D printing to realize reflection at multiple angles. Compared with the prior art, inherent loss caused by an independent design structure is overcome, the defects that an existing structure is complex in design, high in loss, large in size and high in cost are overcome, simplification of the structure and coupling of sound wave reflection units reduce procedures for preparation of an acoustic function device, the preparation precision is improved, and the performance is further improved.

The invention discloses cell grabbing equipment. The cell grabbing equipment comprises a positioning and conveying device and a grabbing device. The positioning and conveying device comprises a conveying mechanism and multiple positioning mechanisms. The conveying mechanism is used for bearing and conveying multiple cells in the first direction, and the multiple positioning mechanisms are used forpositioning the multiple cells on the conveying mechanism. The grabbing device and the positioning and conveying device are oppositely arranged, and the grabbing device is used for grabbing the multiple cells which are positioned and are separated from the conveying mechanism. According to the cell grabbing equipment, the multiple cells can be grabbed at the same time, the grabbing positions areaccurate, and therefore the carrying efficiency of the cells can be improved, and the preparation precision of the cells can be improved.

The invention provides a photoresist pattern preparing method. The photoresist pattern preparing method comprises forming a photoresist layer containing photoinitiator particles on a substrate; placing the substrate with the formed photoresist layer inside a standing wave field so that the photoinitiator particles can be aggregated on the substrate to form a preset pattern; vacuum-drying, pre-baking and ultraviolet-radiating the substrate with the preset pattern to subject the photoinitiator particles in standing wave points to cross-linking reaction; removing photoresist in areas without cross-linking reaction through developing, performing an after-baking process to obtain a planned photoresist pattern. The photoresist pattern preparing method prepares the photoresist pattern according to the principles of standing wave fields, thereby saving a photomask, reducing costs and the operation complexity and improving the preparation precision of the photoresist pattern.

The invention relates to a forming method of a capacitor opening hole and a forming method of a memory capacitor. The forming method of the capacitor opening hole comprises the steps of providing a substrate, forming a sacrificial layer and a supporting layer which are stacked on the surface of the substrate, and forming a plurality of hollow first side wall structures which are arranged at intervals on the surface of the supporting layer; forming a second material layer on the surface of the first side wall structure to form a second side wall structure; and etching the sacrificial layer and the supporting layer by taking the first side wall structure and the second side wall structure as masks so as to form the capacitor opening hole. Through the steps, the first side wall structure and the second side wall structure which are tightly arranged can be formed, the capacitor opening hole is further formed, based on the forming method of the tightly-arranged double-side-wall structure, the communication effect of the capacitor opening hole can be achieved, the capacitor opening hole with a smaller size can be prepared, and then the preparation precision of the capacitor opening hole is improved.

The invention discloses a device and method for preparing a two-dimensional nanosheet material through cooperation of ball milling and cavitation. An output shaft of a motor is coaxially and fixedly connected with the center of a rotating disc, a spiral container is arranged on the front face of the rotating disc, the upper end of the spiral container is connected with an upper feeding and discharging head, and the lower end of the spiral container is connected with a lower feeding and discharging head; an upper magnetic force generator is arranged at the upper end of the upper feeding and discharging head, a lower magnetic force generator is arranged at the lower end of the lower feeding and discharging head, and the upper magnetic force generator and the lower magnetic force generator are the same in structure and each composed of a first connecting plate, a connecting rod, a second connecting plate, electromagnets, bridge type switches and a power source, wherein the multiple electromagnets are fixedly embedded inside the lower end of the second connecting plate, each electromagnet is wound with a coil, and all the coils are connected with the power supply through the bridge switches; a small-diameter section is arranged in the middle of the front surface of each coil of solenoid of the spiral container, and grinding balls can just pass through the small-diameter sections; and the two-dimensional nanosheet material is prepared by spontaneously generating cavitation through common ball milling, so that the efficiency and the preparation precision are effectively improved.

The invention relates to a multi-circle QFN package lead frame manufacturing method, and belongs to the technical field of semi-conductor packaging. According to the technical scheme, the multi-circle QFN package lead frame manufacturing method comprises the following steps that 1 a substrate is provided and needed lead foot graphs are formed on the front face of the substrate; 2 multiple circles of needed outer lead feet are formed on the substrate by the utilization of the lead foot graphs on the substrate; 3 a needed packaging chip is arranged on the substrate and the packaging chip is electrically connected with the outer lead feet on the substrate through connecting lines; 4 plastic packaging is conducted on the packaging chip on the substrate to obtain a plastic packaging body, and the plastic packaging body enables the packaging chip, the connecting lines and the outer lead feet to be pressed on the substrate in a covering mode; 5 etching is conducted on the back face of the substrate so as to separate the packaging chip from the outer lead feet. According to the multi-circle QFN package lead frame manufacturing method, the structure is compact, the technology is simple and convenient to implement, the compatibility is good, the cost is low, and the machining precision and the machining efficiency are high.

The invention discloses a supporting fork type loading device suitable for a modification regeneration of a denitration catalyst. The supporting fork type loading device comprises a laid rail, a powerdevice, a loading device which can move along the rail, a charging trolley and a control cabinet; the charging trolley and the control cabinet are arranged at one end of the rail; the rail is provided with a trigger switch component used for detecting the states of the loading device and the charging trolley; the charging trolley and the power device is connected with the control cabinet; the loading device comprises a base, a rotary shaft transversely arranged at the middle part of the base and an overturning platform which is movably connected with the rotary shaft; the overturning platformis provided with a supporting fork; and the supporting fork clamps a material, the loading device moves to the beside of the charging trolley, the overturning platform reaches a space above the charging trolley after rotating around the rotary shaft, and the material falls into the charging trolley under the effect of the gravity. The supporting fork type loading device is simple and convenient to operate, simple in structure and convenient to maintain and realizes automation, so that the standardized production level of modification regeneration of the denitration catalyst is increased, andthe problems that the catalyst is damaged caused by transportation during regeneration and the like are solved.

The invention provides a quantum dot color conversion layer and a preparation method thereof. The quantum dot color conversion layer comprises a transparent substrate and a micro-channel substrate which are in press fit, and the micro-channel substrate comprises at least one pixel point; each pixel point comprises at least one group of quantum point positions used for injecting a quantum dot solution, a liquid inlet hole used for enabling the quantum dot solution to flow in and a liquid outlet hole used for enabling the quantum dot solution to flow out, and the inlet and the outlet of each quantum point position in each pixel point are respectively communicated with the corresponding liquid inlet hole and the corresponding liquid outlet hole through micro-channels which are not crossed with each other; and the quantum dot solution is injected into each group of quantum dots, and quantum dots for realizing color conversion are formed after the quantum dots are photo-cured. According to the quantum dot color conversion layer, only one micro-channel substrate is needed, color conversion of different colors can be achieved at the same time, a photoetching agent is not doped in quantum dots, and the quantum dots cannot be degraded, so the conversion efficiency of the quantum dots cannot be reduced, and a large amount of waste of the quantum dots cannot be caused.

The invention, which relates to the field of the display technology, discloses a method for preparing a flexible display device. The method comprises: a flexible substrate is divided into a pixel region and a non-pixel region; a rigid buffer layer and a driving circuit layer that are stacked are formed in the pixel region successively; a flexible first isolation layer covering both the pixel region and the non-pixel region is formed on the driving circuit layer; a connection layer is formed on the first isolation layer; a flexible second isolation layer only covering the non-pixel region is formed on the connection layer; a light-emitting device layer and a rigid encapsulation layer that are stacked are formed in the pixel region on the connection layer successively; and a flexible cover plate is formed. According to the preparation method, the rigid buffer layer and the driving circuit layer are only formed in the pixel region, the flexible first isolation layer, the connection layerand the flexible second isolation layer are only formed in the non-pixel region, and thus the stress mainly is connected in the non-pixel region. Therefore, the flexible bending effect is good; a phenomenon that the device characteristics are changed due to bending is avoided; and the reliability and the use effect of the flexible display device are improved.

The invention discloses a high-precision quick-cooling crankshaft mold structure. The structure comprises a base; a mounting plate is arranged at the upper end of the base; side plates are arranged onthe two sides of the upper end surface of the mounting plate; a supporting frame is arranged between the base and the mounting plate; a motor is arranged on one side of the supporting frame; a turbine is arranged in the supporting frame; bearings are arranged at the bottoms of the two sides of the base; threaded rods are sleeved with the bearings; a hydraulic cylinder is arranged in the center ofthe base; a containing seat is arranged at the upper end of the mounting plate; a lower mold is arranged between two locking assemblies; buffer assemblies are arranged on the two sides of the mounting plate; a mounting frame is erected at the upper ends of the side plates; and an upper mold is arranged on the mounting frame through the locking assemblies. According to the high-precision quick-cooling crankshaft mold structure, the buffer assemblies and the hydraulic cylinder are arranged, so that the structure has the relatively-high preparation precision, and unnecessary waste of materials is avoided; and a spraying plate and a heat dissipation assembly are arranged, so that the structure has the good cooling efficiency, and the preparation time is greatly shortened.

The invention relates to a method for depositing a core layer of an optical fiber preform with a gradient refractive index profile, which comprises the following steps of clamping a quartz glass tube or a target rod on a rotary chuck, axially reciprocating a microwave resonant cavity or a flame blast burner along the quartz glass tube or the target rod, and introducing reaction gas by controlling the opening degree of a flow meter to form a doped quartz glass deposition layer. The method is characterized in that a whole core layer deposition area is divided into k*(m+1) matrix point locations, a doped deposition vector of each point location is a calibrated doped deposition vector after a mother rod is measured and calculated, and the calibrated doped deposition vector is used for controlling and adjusting the opening degree of a reaction gas flow meter, and the opening control and adjustment of the flow meter are continuously and gradually changed among the point positions. The axial consistency of the core rod can be controlled and improved while the radial precision of the core layer is controlled and improved, so that the preparation precision and the effective rod length of the core layer of the gradient refractive index optical fiber preform rod are improved, and the qualified ratio of optical fiber output is improved.

The embodiment of the invention provides an electrostatic adsorption device and a preparation method thereof. The electrostatic adsorption device and the preparation method thereof solve the problemsthat the electrode machining precision of an existing electrostatic adsorption device is difficult to control, the insulating property of an electrode structure is poor, and the generated adsorption force is poor. The electrostatic adsorption device provided by the embodiment comprises an insulating layer, a conductive layer and an insulating line region, the conductive layer is arranged on the surface of the insulating layer, the insulating line region is arranged on the surface of the insulating layer, wherein the insulating line region penetrates through the conductive layer to divide the conductive layer into a positive electrode region and a negative electrode region.

The invention discloses a chip packaging structure and method of an integrated passive element. The chip packaging structure of the integrated passive element comprises a packaging body, a passive element layer, a first insulating layer, a conductive column, a rewiring layer, wherein a chip is packaged in the packaging body; a device surface of the chip and a first surface of the packaging body are located at the same plane; the passive element layer is arranged at a second surface of the packaging body; the first insulating layer is arranged on the passive element layer; the conductive columnis arranged in the packaging body, one end of the conductive column is coupled to the passive element layer, and the other end of the conductive column is located at the same plane with the first surface of the packaging body; and the rewiring layer is arranged at the first surface of the packaging body and is coupled to the chip and the conductive column. The chip packaging structure is providedwith the passive element layer at the second surface of the packaging body, thereby solving a problem of great thickness of the chip packaging structure integrated with a plurality of passive elements due to embedment of the passive elements in the rewiring layer in the prior art, and reducing the thickness of the packaging structure of the plurality of passive elements.