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Electrostatic adsorption device and preparation method thereof

An electrostatic adsorption and conductive layer technology, which is applied in lamination devices, workpiece clamping devices, chemical instruments and methods, etc., can solve the problems of poor electrode structure insulation, poor adsorption force, and difficult control of electrode processing precision, etc., to improve electrostatic Adsorption force, dense electrode pattern, and the effect of reducing the difficulty of preparation

Inactive Publication Date: 2020-03-06
MAGIC ADHESION BEIJING TECH CO LTD
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  • Abstract
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Problems solved by technology

[0004] In view of this, the embodiment of the present invention provides an electrostatic adsorption device and its preparation method, which solves the problems of difficult control of electrode processing accuracy, poor electrode structure insulation and poor adsorption force generated by existing electrostatic adsorption devices.

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  • Electrostatic adsorption device and preparation method thereof
  • Electrostatic adsorption device and preparation method thereof
  • Electrostatic adsorption device and preparation method thereof

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Embodiment Construction

[0037]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0038] figure 1 It is a schematic structural diagram of an electrostatic adsorption device provided by an embodiment of the present invention. like figure 1 As shown, the electrostatic adsorption device includes: an insulating layer 1, a conductive layer 2 arranged on the surface of the insulating layer 1, and a continuous insulating line region 3 arranged on the surface of the insulating layer 1, wherein the insulating line region 3 runs through the ...

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Abstract

The embodiment of the invention provides an electrostatic adsorption device and a preparation method thereof. The electrostatic adsorption device and the preparation method thereof solve the problemsthat the electrode machining precision of an existing electrostatic adsorption device is difficult to control, the insulating property of an electrode structure is poor, and the generated adsorption force is poor. The electrostatic adsorption device provided by the embodiment comprises an insulating layer, a conductive layer and an insulating line region, the conductive layer is arranged on the surface of the insulating layer, the insulating line region is arranged on the surface of the insulating layer, wherein the insulating line region penetrates through the conductive layer to divide the conductive layer into a positive electrode region and a negative electrode region.

Description

technical field [0001] The invention relates to the technical field of electrostatic adsorption, in particular to an electrostatic adsorption device and a preparation method thereof. Background technique [0002] Electrostatic adsorption refers to a technology that generates an electric field by applying a voltage between electrodes, thereby inducing a charge to induce electrostatic adsorption. Electrostatic adsorption technology has been widely used in industries such as steel production, wood production and mold processing and manufacturing. However, with the continuous deepening of research in related fields, how to apply electrostatic adsorption technology to more scenes including daily life scenes has gradually become a research hotspot. [0003] In order to apply the electrostatic adsorption technology to more scenarios, it is necessary to improve the integration and reliability of the electrostatic adsorption device. In the existing electrostatic adsorption device, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25J15/00B25B11/00B32B37/12
CPCB25J15/0085B25B11/00B32B37/1284B32B2307/202B32B2307/206
Inventor 汪海涛徐绍宸李富海
Owner MAGIC ADHESION BEIJING TECH CO LTD
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