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Multi-circle QFN package lead frame manufacturing method

A technology for encapsulating leads and frames, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc. It can solve problems such as difficult to meet the use requirements, complicated preparation process, and low processing accuracy, so as to reduce damage and improve manufacturing Good precision and product uniformity

Inactive Publication Date: 2013-12-25
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing multi-turn QFN adopts stamping method to prepare lead frame, which requires expensive molds and equipment, complex preparation process, poor flexibility, high cost, low processing accuracy, and difficult to meet the needs of use

Method used

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  • Multi-circle QFN package lead frame manufacturing method
  • Multi-circle QFN package lead frame manufacturing method
  • Multi-circle QFN package lead frame manufacturing method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0030] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0031] Such as Figure 1~Figure 9 Shown: in order to be able to prepare multi-circle QFN package lead frame conveniently, reduce processing cost, improve production precision and efficiency, the preparation method of package lead frame of the present invention comprises the following steps:

[0032] a. Provide the substrate 1, and set and form the required pin pattern 12 on the front surface of the substrate 1;

[0033] Such as Figure 1~Figure 4 As shown: in the embodiment of the present invention, the material of the substrate 1 includes copper. In order to obtain the pin pattern 12 on the substrate 1, the step a includes the following steps:

[0034] a1, providing the substrate 1, and setting the required dry film 2 on the front surface of the substrate 1;

[0035] The type of dry film 2 provided on the substrate 1 can be determined according to the requi...

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Abstract

The invention relates to a multi-circle QFN package lead frame manufacturing method, and belongs to the technical field of semi-conductor packaging. According to the technical scheme, the multi-circle QFN package lead frame manufacturing method comprises the following steps that 1 a substrate is provided and needed lead foot graphs are formed on the front face of the substrate; 2 multiple circles of needed outer lead feet are formed on the substrate by the utilization of the lead foot graphs on the substrate; 3 a needed packaging chip is arranged on the substrate and the packaging chip is electrically connected with the outer lead feet on the substrate through connecting lines; 4 plastic packaging is conducted on the packaging chip on the substrate to obtain a plastic packaging body, and the plastic packaging body enables the packaging chip, the connecting lines and the outer lead feet to be pressed on the substrate in a covering mode; 5 etching is conducted on the back face of the substrate so as to separate the packaging chip from the outer lead feet. According to the multi-circle QFN package lead frame manufacturing method, the structure is compact, the technology is simple and convenient to implement, the compatibility is good, the cost is low, and the machining precision and the machining efficiency are high.

Description

technical field [0001] The invention relates to a preparation method, in particular to a preparation method of a multi-turn QFN packaging lead frame, which belongs to the technical field of semiconductor packaging. Background technique [0002] Multi-turn QFN (Quad Flat No-lead Package) is a new package developed recently. Its basic structure is similar to that of QFN package. The difference is that it has multiple rows of outer pins, which can be staggered. , to increase the density of outer pins. Existing multi-turn QFN adopts stamping method to prepare lead frame, which requires expensive molds and equipment, complex preparation process, poor flexibility, high cost, low processing accuracy, and difficult to meet the use requirements. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a method for preparing a multi-turn QFN package lead frame, which has a compact structure, simple and conv...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/50
CPCH01L2224/48091H01L2224/48247H01L2224/73265H01L2924/181H01L2924/00014H01L2924/00012
Inventor 刘文龙
Owner NAT CENT FOR ADVANCED PACKAGING
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