Silicon wafer bearing table for photoetching machine and use method thereof

Abstract

The invention discloses a silicon wafer bearing table for a photoetching machine, which comprises a bearing table base, a plurality of vacuum holes, a plurality of stress inductors, a connector and a silicon wafer transfer device, wherein the plurality of vacuum holes and the silicon wafer transfer device are arranged on the bearing table base; the connector is arranged at the bottom of the bearing table base; and the stress inductors are arranged on the surface of the bearing table base. The stress inductors are connected with an electric power conversion circuit of which the output end is connected with a terminal controller, and the terminal controller is connected with a power motor. The stress inductors realize expansion and regulate height by inducting the information of action points, magnitudes, directions and the like of acting force from silicon wafers. By regulating the height of each stress inductor which is in contact with the silicon wafers, the silicon wafer bearing table for the photoetching machine of the invention can ensure that the front sides of the silicon wafers are on the same horizontal plane at all times, thereby preventing the images on the front sides from being out of focus caused by contaminants of particles and the like on the back sides of the silicon wafers, and reducing rework of photoetching. The invention also discloses a use method of the silicon wafer bearing table for the photoetching machine.

Description

technical field [0001] The invention relates to semiconductor manufacturing equipment, in particular to a photolithography machine silicon wafer carrier, and the invention also relates to a method for using the photolithography silicon wafer carrier. Background technique [0002] In the currently used silicon wafer carrier, the surface in contact with the silicon wafer is fixed. Using this silicon chip carrier, if the back side of the silicon chip has dirt such as particles, the front side of the silicon chip is not on the same level. When the photolithography machine is exposed, the front pattern area corresponding to the particles on the silicon wafer will be defocused, resulting in a change in the shape of the photolithographic pattern, and the affected silicon wafer needs to be photolithographically reworked. Seriously affected silicon wafers and even lithography rework cannot solve the problem and affect product quality. [0003] If the particles on the silicon wafer ...

AI Technical Summary

Problems solved by technology

Seriously affected silicon wafers and even lithography rework cannot solve the problem and affect product quality

[0003] If the particles on the silicon wafer fall on the carrier platform, it will also affect the product quality of subsequent operations, resulting in a waste of lithography resources and an increase in production costs.

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