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Cavity window and plasma process cavity

A process chamber and chamber technology, which is applied in the field of plasma process chambers, can solve the problems of etching, the influence of processing technology, the increase of the roughness of the chamber window 3, etc., so as to achieve the effect of prolonging the service life and reducing the influence.

Active Publication Date: 2010-06-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] During processing, the inner side of the chamber window 3 is exposed to the plasma gas, so it will be bombarded and corroded by the plasma gas. After a period of use, the inner side of the chamber window 3 will have increased roughness and will be etched. The processing technology is affected, and the service life of the chamber window 3 will be shortened

Method used

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  • Cavity window and plasma process cavity
  • Cavity window and plasma process cavity
  • Cavity window and plasma process cavity

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Embodiment Construction

[0015] The chamber window of the present invention, its preferred embodiment is as image 3 As shown, the upper cover 5 is included, and the lower surface of the upper cover 5 is provided with a liner 6 . During the process, the inner liner 6 can protect the upper cover 5 .

[0016] The edge of the chamber window can be provided with a wedge-shaped support 7, and the edges of the upper cover 5 and the lining 6 are respectively provided with inclined surfaces, and the inclined surfaces coincide with the wedge-shaped surfaces of the wedge-shaped support 7. The wedge-shaped support 7 supports the lining 6 .

[0017] A sealing device is provided between the inclined surface of the edge of the upper cover 5 and the wedge-shaped surface of the wedge-shaped support 7, and the sealing device can be an "O" ring 8 or other flexible sealing rings. When the loam cake 5 and the lining 6 were supported on the wedge-shaped support 7, the inclined surface of the upper cover 5 edge and the w...

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Abstract

The invention discloses a cavity window and a plasma process cavity. The cavity window comprises an upper cover, wherein an inside lining is arranged on the lower surface of the upper cover, a wedge-shaped support is arranged at the edge part of the cavity window, the upper cover and the inside lining are supported on the wedge-shaped support, a seal ring is arranged between the upper cover and the wedge-shaped support, and the wedge-shaped support is supported on the cavity body of the process cavity. In the technical process, the upper cover part is mainly used for bearing the atmospheric pressure; the inside lining part is mainly used for resisting plasma gas impact and corrosion and performs a protecting action for the upper cover, and the inside lining can be replaced to prolong the service life of the upper cover and reduce the influence on the processing process.

Description

technical field [0001] The invention relates to a plasma device, in particular to a chamber window and a plasma process chamber. Background technique [0002] At present, plasma technology has been widely used in the field of semiconductor preparation and processing. [0003] Such as figure 1 As shown, in the prior art, the plasma process chamber is composed of a chamber body 1, a sealing ring 2, and a chamber window 3 to form a closed space. During the plasma process, the process gas enters the process chamber through the nozzle to process the substrate supported on the support of the lower electrode. [0004] Such as figure 2 As shown, in the prior art, the window of the chamber window 3 is composed of a layer of dielectric material, which is directly arranged on the sealing ring 2, and a flexible sealing ring 4 may be provided between the chamber window 3 and the sealing ring 2 . [0005] There are at least the following disadvantages in the above-mentioned prior art...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/3065H01J37/32
Inventor 李俊杰
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD