Multispectral sensitization device and manufacturing method thereof

A photosensitive device and multi-spectral technology, applied in semiconductor/solid-state device manufacturing, electrical components, radiation control devices, etc., can solve the problem of reduced sensitivity of filter films, inability to sense light corresponding to different scenes, and insufficient space and energy usage efficiency layers and other issues to achieve low-cost effects
CN101740587BInactive Publication Date: 2012-08-29BOLY MEDIA COMM SHENZHEN
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BOLY MEDIA COMM SHENZHEN
Publication Date
2012-08-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a multispectral sensitization device and a manufacturing method thereof. The device comprises at least one non-transparent basement layer, each basement layer is composed of at least two surfaces, each surface is provided with sensitization pixel groups which are used for inducing light of optional spectrum coming from the positive direction of the surfaces where the sensitization pixel groups are located; or the device comprises at least one transparent basement layer, each basement layer is composed of at least two surfaces, each surface is provided with sensitization pixel groups which are used for inducing light of optional spectrum coming from the positive side or the reverse side of the surfaces where the sensitization pixel groups are located. In the invention, bidirectional sensitization can be realized through a same device, different scenes in two different directions can be induced; in addition, the device can be used for unidirectional sensitization to improve properties of the sensitization device.
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Description

technical field

[0001] The invention relates to a multi-spectrum photosensitive device and a manufacturing method thereof. More precisely, the present invention relates to a photosensitive device for full-color images capable of simultaneously sensing multiple spectrums (such as visible light and infrared light) and a fabrication method thereof. Here, panchromatic refers to the entire spectrum of interest. For ordinary (visible light) photosensitive devices, panchromatic refers to covering the entire visible spectrum of red, green, blue and white. For photosensitive devices that combine infrared and color, panchromatic refers to the visible spectrum and the infrared spectrum. The invention is applicable to multispectral photosensitive devices including black and white and color images. Background technique

[0002] The traditional technology of designing and manufacturing color image photosensitive chips (or devices) either uses single-layer photosensitive pixels or three...

Claims

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