Productive technology of flexible printed circuit board

Abstract

The invention discloses a productive technology of a flexible printed circuit board, comprising the following steps: (1) cutting pure copper 1, pure copper 3, a double faced adhesive tape cover layer and a single faced adhesive tape cover layer; (2) drilling out registration holes on pure copper 1 and pure copper 3, punching the single faced adhesive tape cover layer and the double faced adhesive tape cover layer to leave an opening; (3) assembling pure copper 1 on one side of the double faced adhesive tape cover layer; (4) assembling pure copper 3 on the other side of the double faced adhesive tape cover layer; (5) drilling pure copper 1 and pure copper 3 to form a through hole; (6) plating copper on the surface of a semi-finished printed circuit board; (7) etching copper at the openings of the bending area reserved by pure copper 3 and the conductive area corresponding to the double faced adhesive tape cover layer to manufacture required circuits; (8) respectively assembling the two single faced adhesive tape cover layers corresponding to the outer surfaces of pure copper 1 and pure copper 3; (9) coating noble metal at the reserved opening position of the single faced adhesive tape cover layer; and (10) punching to manufacture the appearance of products. The method has low manufacturing cost, simple process, high working efficiency and good cost and quality.

Description

technical field [0001] The invention relates to a production process of a flexible circuit board. Background technique [0002] At present, with the development of centralization of production and miniaturization of equipment, more and more electronic equipment is manufactured using integrated circuits. Integrated circuits arrange all electronic components on a pre-fabricated circuit board, and with the production quality With the improvement, the circuit board has gradually developed from hard characteristics to flexible materials, such as figure 1 Shown is a commonly used process flow for manufacturing a flexible circuit board, and each process will be described in detail below. [0003] refer to figure 2 Shown is a schematic diagram of the production process of the existing production process, which mainly includes the following steps: [0004] (1) Cutting: Cut all raw materials according to the required specifications and sizes; [0005] (2) Pure copper drilling: dr...

AI Technical Summary

Problems solved by technology

[0019] (a) In step (7), in order to avoid the impact on the bending area 80 and the bottom conduction area 901 during copper sinking, it is necessary to manually paste a layer of anti-plating on the surface of the single-sided adhesive copper clad laminate 30 and pure copper 10 Adhesive tape, because the thickness of the semi-finished product is very thin, it is necessary

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