Method for manufacturing circuit board and copper clad substrate suitable for same

Abstract

The invention provides a method for manufacturing a circuit board, comprising the following steps: providing a first substrate and a second substrate; making circuits in first making zones of the first substrate; detecting the circuits on the first substrate and forming marks which indicate the states of the circuits in the first making zones in first detection zones; laminating the second substrate on the surface of the first substrate; and forming an observation windows in second detection zones of the second substrate so as to facilitate observing the marks of the states of the circuits inthe first detection zones of the first substrate from the observation window, wherein the first substrate comprises a plurality of first making zones which comprise the first detection zones; and thesecond substrate comprises a plurality of second making zones corresponding to the first making zones, and the second making zones comprise second detection zones corresponding to the first detectionzones. The invention also provides a copper clad substrate suitable for the method.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a circuit board manufacturing method and a copper-clad substrate suitable for the manufacturing method. Background technique [0002] With the rapid development of the electronics industry, the manufacturing technology of circuit boards, which are the basic components of electronic products, is becoming more and more important, and the requirements for making circuits and holes are becoming more and more refined. Circuit boards are divided into single-sided boards, double-sided boards and multi-layer boards, all of which are made of copper-clad substrates through a series of processes such as cutting, drilling, etching, exposure, development, lamination, and molding. For details, please refer to the article "Dielectric characterization of printed circuit board substrates" published by C.H.Steer et al. in Proceedings of the IEEE, Vol.39, No.2 (August 2002). [0003] Durin...

AI Technical Summary

Problems solved by technology

However, if there is a defect in the inner layer, such as an open circuit or a short circuit, even if a mark is set on the production area of ​​the defective first substrate, the defective mark on the first substrate will be covered by the laminated second substrate, so it is difficult to easily A quick way to identify whether the circuit board unit after molding and division is a bad circuit board unit

In this way, it may cause defective circuit board units to continue to be processed in subsequent processes, thereby affecting production efficiency and increasing the production cost of circuit boards.

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