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Plasma processing equipment

A kind of processing equipment, plasma technology, applied in the direction of metal material coating process, gaseous chemical plating, coating, etc.

Active Publication Date: 2013-06-05
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0006] However, in practical applications, the above-mentioned PECVD equipment divides a process into two steps to complete, which will inevitably affect the process quality, especially in the PECVD thin film process, the formation of The two-layer film will produce a clear interface and affect the overall performance of the film
Moreover, if the equipment is set to adopt a process chamber to complete the structure of the entire process, each process chamber needs to be equipped with a set of loading and unloading systems, which will greatly increase the cost of the equipment, and the loading chamber and the unloading chamber will be on standby most of the time, resulting in a waste of equipment resources

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Embodiment Construction

[0015] In order to enable those skilled in the art to better understand the technical solution of the present invention, the plasma processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0016] see figure 2 , the plasma processing equipment provided by the present invention specifically includes: a loading platform, a loading chamber, three process chambers (that is, process chambers A, B, and C) arranged in parallel, an unloading chamber, an unloading platform, and a serial A transfer chamber connected between the loading chamber and the unloading chamber. The three process chambers are connected in parallel to the side of the transfer chamber, so that the workpieces can be transferred for one alone or for multiple process chambers at the same time by means of the transmission mechanism inside the transfer chamber.

[0017] Wherein, the serial connection of the transfer chamber between the load...

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Abstract

The invention provides plasma processing equipment, which comprises a loading chamber, a transmission chamber, N process chambers (N is an integer more than or equal to 1), and an unloading chamber, wherein the transmission chamber is connected in series between the loading chamber and the unloading chamber; the lateral surface of the transmission chamber is parallelly connected with the N process chambers; the transmission chamber can simultaneously transmit workpieces among the parallelly arranged N process chambers by utilizing a vertical transmission part and a horizontal transmission part which are arranged in the transmission chamber; and each process chamber independently completes the whole process, and does not influence one another. Therefore, the plasma processing equipment canimprove product quality, save equipment cost and effectively improve equipment capacity.

Description

technical field [0001] The invention relates to the technical field of workpiece transmission, in particular to a plasma processing device. Background technique [0002] In today's society, the semiconductor manufacturing industry has formed a perfect market model. With the continuous popularization of semiconductor technology, manufacturers are facing increasingly fierce market competition. Therefore, these manufacturers are required to maximize the use of equipment capacity and continuously improve production efficiency to cope with increasingly fierce market competition. [0003] In order to maximize the utilization of equipment capacity, it is necessary to ensure that the production equipment is always in working condition, and try to avoid equipment idleness caused by other links (such as loading and unloading of workpieces, etc.). [0004] For this reason, a plasma processing equipment with two serial process chamber structures has been proposed to improve production...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/44
Inventor 蒲春
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD