Packaging module of low-power light emitting diode (LED) luminescent chip

Abstract

The invention discloses a packaging module of a lower-power light emitting diode (LED), comprising an aluminum substrate and an LED luminescent chip. The aluminum substrate sequentially consists of an aluminum substrate copper clad layer, an insulating thermal conductive adhesive layer and an aluminum base layer, and the LED luminescent chip is placed on the aluminum substrate. The aluminum substrate is provided with a counter bore at the placing position of the LED luminescent chip. The aluminum substrate copper clad layer and the insulating thermal conductive adhesive layer at the corresponding position of the aluminum substrate are removed, and high thermal conductive elargol is utilized for filling and solidification. The LED luminescent chip is connected with a circuit on the aluminum substrate copper clad layer through a metal wire and packaged with a transparent silica gel layer to form a luminescent module. The invention solves the problems of radiation and attenuation of the LED chip as well as the lighting angle and brightness contradiction of a low-power chip, and ensures that the low-power LED luminescent chip can be applied to illumination.

Description

Technical field: [0001] The invention relates to a package structure of an LED light-emitting chip, in particular to a flat package module of an LED low-power light-emitting chip. Background technique: [0002] Light Emitting Diode (LED) is a component made of semiconductor materials. It is also a very fine solid-state light source that can convert electrical energy into light. It is not only small in size, but also has long life, low driving voltage, fast response rate, and shock resistance. Excellent performance, can meet the light, thin and miniaturization requirements of various application equipment, has become a very popular product in daily life. [0003] Light-emitting diodes use various compound semiconductor materials and changes in component structures to design red, orange, yellow, green, blue, purple and other colors, as well as infrared, ultraviolet and other invisible light LEDs. Materials suitable for making high-brightness LEDs above 1000med, whose waveleng...

AI Technical Summary

Problems solved by technology

[0011] In order to solve the problems existing in the packaging of the existing white light LED low-power light-emitting chips for lighting using traditional technology, the present invention provides a packaging structure of LED light-emitting chips that can avoid the above-mentioned problems

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