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High-power LED lighting device

A technology of LED lighting and high power, applied in lighting devices, lighting device parts, lighting device cooling/heating devices, etc. The effect of small conduction heat resistance, high heat exchange efficiency and high reliability

Inactive Publication Date: 2010-06-23
冉秀艳 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The lighting device described in the above patents has large thermal resistance, low heat exchange efficiency, complex structure, high cost and poor reliability.

Method used

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Examples

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Embodiment Construction

[0019] exist figure 1 figure 2 Among them, the high-power LED lighting chip (1) is welded on the circuit board (2) and then subjected to insulation and waterproof treatment, so that the heat sink (3) can be directly exposed to work in the air. The heat generated by the high-power LED lighting chip (1) is transferred to the heat sink (3) exposed in the air through the circuit board (2). As the hot air rises, the cold air passes through the air pair designed on the heat sink (3). The flow channel (4) forms air circulation, convection and heat dissipation. The heat generated during the work of the high-power LED lighting chip (1) is quickly exchanged with the environment, and the simple process effectively ensures that the LED lighting chip (1) works in a good temperature environment. Simple structure, low cost, no fan heat pipe and other mechanisms, high reliability, can be widely used in various led lamps, such as street lights, tunnel lights, flood lights, strip lights, wal...

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Abstract

The invention discloses a high-power LED lighting device, which mainly comprises an LED lighting chip, a circuit board and a radiating fin. The high-power LED lighting device is characterized in that: the LED lighting chip is welded on the circuit board which is closely connected with the radiating fin; the heat generated when the LED lighting chip works is transferred to the radiating fin; waterproof and insulating treatment is performed on the LED chip and circuits so that the radiating fin can be bared in the air directly; an air convection channel is designed on the radiating fin, so the heat which is transferred to the radiating fin when the LED lighting chip works enables hot air to rise, and cold air forms air convection to perform circulation radiation through the air convection channel so as to exchange heat with the environment rapidly. The high-power LED lighting device has the characteristics of low thermal-conduction resistance, insulativity and waterproof performance, utilization of air circular convection for radiating, high heat exchange efficiency, simple implementation process, capability of effectively ensuring that the LED lighting chip works in good temperature environment, simple structure, low cost, no mechanisms of a fan or the like and high reliability, and can be widely applied to various LED lighting devices such as a street lamp, a tunnel road, a flood lamp, a strip lamp and a wall washing lamp.

Description

technical field [0001] The invention relates to an LED lighting device, in particular to a high-power LED lighting device with a heat dissipation structure. Background technique [0002] As the fourth-generation lighting source, Led is becoming more and more well-known to people. It can be seen from numerous patents on LED heat dissipation that heat dissipation is a key technology that has always plagued the application of LEDs. At present, the high-power LED lighting devices in the industry, especially some outdoor lighting devices, have IP rating requirements for the airtightness of the lighting devices, and natural convection heat dissipation cannot be adopted, which makes the heat dissipation problem more severe. [0003] In the document of patent 200710124533, a method of heat absorbing plate + heat pipe + heat sink is disclosed. The heat generated by the high-power LEDs sealed in the waterproof lampshade is conducted to the heat pipe through the heat absorbing plate, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V19/00F21V29/00H01L23/34F21Y101/02F21V29/83
CPCY02B20/72
Inventor 冉秀艳霍健黄伟
Owner 冉秀艳
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