Adjustment method for center line of rotary kiln cylinders
An adjustment method and centerline technology are applied in the field of adjustment of the centerline of the rotary kiln, which can solve the problems of large deviation of the centerline of the cylinder, and achieve the effects of reducing the deviation of the centerline, reducing the installation cost and improving the installation progress.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0023] See figure 1 , figure 2 , image 3 , the adjustment method of the center line of the rotary kiln cylinder, the method includes the following steps:
[0024] 1. Coarse adjustment; connect the adjacent cylinders with bolts on the inner side of the cylinder, so that the connection ports of the adjacent cylinders are on the top;
[0025] 2. Fine adjustment;
[0026] 1) Mark the center line by the infrared measuring instrument, so that the center line of the cylinder body on the base seat of the active end and the base seat of the active end forms a line, and other cylinder bodies are adjusted based on this straight line;
[0027] 2) Adjust each cylinder by adjusting the crescent base 1, use the infrared measuring instrument 8 to measure the deviation between the center point of each cylinder and the reference line, and adjust each cylinder according to the deviation value, so that the two sides of each cylinder are The center points are all on the above reference line....
PUM

Abstract
Description
Claims
Application Information

- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com