Solder collecting device for reliability testing of semiconductor element and method thereof
A collection device and semiconductor technology, applied in the direction of semiconductor/solid-state device testing/measurement, measuring devices, mechanical devices, etc., can solve problems such as accidental movement of solder ball debris, missing solder ball debris, and lack of related devices for collecting solder ball debris
Inactive Publication Date: 2012-05-09
ASE ASSEMBLY & TEST SHANGHAI
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Problems solved by technology
[0005] However, during the reliability test of the above-mentioned high-speed ball pushing experiment, there is currently a lack of relevant devices for collecting the remains of the solder balls
Thus, in practice, after the ball has been pushed off, the ball remains may be scattered in many scattered places on one side of the substrate, and the scattered ball remains are susceptible to accidental removal by operators, sometimes more likely Lost solder ball debris, which seriously affects the efficiency of collecting solder ball debris and measurement accuracy, or increases the cost of re-experimentation
Method used
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[0021] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention will be specifically cited below, together with the accompanying drawings, for a detailed description as follows:
[0022] Please refer to figure 1 and 2 , which discloses a schematic assembly diagram of a solder collection device for reliability testing of semiconductor components in a preferred embodiment of the present invention, wherein the solder collection device includes a collection box 1, a ventilation unit 2 and at least one adhesive layer 3, which is Applied in the reliability test of the high-speed ball pushing experiment, the airflow generated by the ventilation unit 2 attracts solder residues into the collection box 1 and adheres to the adhesive layer 3, so as to collect the solder residues for analysis and testing. The present invention is applicable to the field of reliability...
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The invention discloses a solder collecting device for reliability testing of a semiconductor element and a method thereof. The solder collecting device comprises a collecting box, an air draft unit and at least one adhesive layer, wherein the collecting box is provided with a ball collecting space, an open side and an air draft side. The open side is positioned on one side of the ball collectingspace for receiving external solder remains; the air draft side is positioned on the other side of the ball collecting space, and an air draft unit is arranged on the air draft side to draft air in the ball collecting space, leading the solder remains to enter the ball collecting space through the open side; and the adhesive layer is at least arranged on the lower surface of the ball collecting space to adhere the solder remains. The solder collecting method utilizes the solder collecting device to carry out the reliability testing of high-speed ball push test so as to conveniently collect the solder remains.
Description
【Technical field】 [0001] The present invention relates to a solder collection device and method for reliability testing of semiconductor components, in particular to a solder collection device and method used for reliability testing of semiconductor components in a semiconductor packaging structure for high-speed ball pushing experiments . 【Background technique】 [0002] Nowadays, in order to meet various high-density packaging requirements, the semiconductor packaging industry has gradually developed various types of packaging structures, among which the common packaging structures with substrates include ball grid array packaging structures (ball grid array, BGA) , a pin grid array package structure (pin grid array, PGA), a land grid array package structure (land grid array, LGA) or a board on chip package structure (board on chip, BOC), etc. In the above ball grid array package (BGA), at least one chip is carried on the upper surface of the substrate, and several pads of...
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IPC IPC(8): G01N19/04H01L21/66
Inventor 龚恒玉
Owner ASE ASSEMBLY & TEST SHANGHAI