Image sensor camera module and method of manufacturing the same

Abstract

The present invention relates to an image sensor camera module and a method of manufacturing the same. An image sensor camera module according to the present invention includes a lens; a lens housing having the lens mounted thereto; an image sensor package adhering to a portion of an inside of the lens housing; and a protruding portion for maintaining a gap between the lens and the image sensor package, wherein the image sensor package adheres to the lens housing at an outside of the protruding portion. According to the present invention, since a lens barrel is not used and a focus adjusting process is not performed, the process simplification and automation process can be achieved, thereby saving a manufacturing cost and obtaining uniform focus quality. Further, it is possible to prevent an image defect from being generated by foreign substances, thereby improving a yield.

Description

technical field [0001] The present invention relates to an image sensor camera module, and more particularly, to an image sensor camera module in which a focus adjustment process is not performed, and a manufacturing method of the image sensor camera module. Background technique [0002] An image sensor is a semiconductor device capable of taking a picture of an image of a person or an object. As these image sensors are embedded in commercially available cellular phones and digital cameras or video cameras, the market for image sensors is rapidly expanding. Such image sensors are manufactured in the form of camera modules and installed in the above-mentioned devices. [0003] A camera module usually includes a lens, a holder, an image sensor, and a printed circuit board, and is packaged in a chip on board (COB), chip scale package (CSP) or chip on film (COF) method to manufacture. In the camera module, the image sensor is electrically connected to the printed circuit boar...

AI Technical Summary

Problems solved by technology

If such particles are introduced into the image sensor, they may cause image defects in the camera module

In addition, the image sensor and the holder may be caused to tilt during the process of manufacturing the camera module, and thus the uniformity of the focus quality of the camera module may not be achieved

[0006] Meanwhile, since a conventional camera module should be installed with a separate IR filter to pass light having a specific wavelength band, it will inevitably increase the cost and deteriorate the light transmittance.

In addition, especially when the flange back length (FBL) from the image sensor to the bottom of the lens is configured to be short, it is difficult to install an IR filter, which may make it difficult to design a lens with a short FBL

[0007] It can be seen that the above-mentioned existing camera module and its manufacturing method obviously still have inconveniences and defects in product structure, manufacturing method and use, and need to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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