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Sensor shell and manufacturing method thereof

A manufacturing method and sensor technology, applied in the direction of electrical components, electronic switches, pulse technology, etc., can solve the problem of insufficient protection of sensors and achieve the effect of high hardness

Active Publication Date: 2010-06-30
CHANGWEI TECH SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present invention is to provide a sensor housing, aiming to solve the problem that the existing sensor housing cannot fully protect the sensor

Method used

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  • Sensor shell and manufacturing method thereof
  • Sensor shell and manufacturing method thereof
  • Sensor shell and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Follow the steps below to prepare the sensor housing.

[0041] 1. Preparation of binder

[0042] According to parts by weight, 50 parts of paraffin, 35 parts of polypropylene, 5 parts of stearic acid and 10 parts of low-density polyethylene grafted maleic anhydride are evenly mixed to prepare a binding agent for future use.

[0043] 2. Prepare the proximity switch sensor housing

[0044] (1) According to parts by weight, 95 parts of Si 3 N 4 and 5 copies of Y 2 o 3 Mix together to form the first mixture; according to parts by weight, take 77.5 parts of the above-mentioned first mixture and 22.5 parts of the above-mentioned binder and uniformly mix to obtain the second mixture.

[0045] (2) After the second mixture is granulated, drop into an injection molding machine for injection molding (using a cylindrical proximity switch sensor shell mold) to form a cylindrical proximity switch sensor shell;

[0046] (3) Place the semi-finished product obtained in step (2) in...

Embodiment 2

[0049] (1) According to parts by weight, 97 parts of Si 3 N 4 and 3 copies of Y 2 o 3 Mix together to form the first mixture; according to weight, take 70 parts of the above first mixture and 30 parts of the above binder and uniformly mix to obtain the second mixture.

[0050] (2) After the second mixture is granulated, drop into an injection molding machine for injection molding (using a cylindrical proximity switch sensor shell mold) to form a cylindrical proximity switch sensor shell;

[0051] (3) Place the semi-finished product obtained in step (2) in heptane to dissolve the paraffin in the original binder and take it out.

[0052] (4) Under an argon atmosphere, sinter at 1700° C. (to remove the residual binder together) to obtain a cylindrical proximity switch sensor housing.

Embodiment 3

[0054] The method is basically the same as in Example 1, except that step (1): according to parts by weight, 92 parts of Si 3 N 4 and 8 copies of Y 2 o 3 Mixed together to form the first mixture; according to the parts by weight, take 76 parts of the above first mixture and 24 parts of the above binder and uniformly mix to obtain the second mixture.

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Abstract

The invention provides a sensor shell and a manufacturing method thereof. The sensor shell comprises a shell body, one end of the shell body is provided with a wire outlet and the other end is provided with a sensing face, the shell body is integrated and molded with the sensing face by ceramic material, and the ceramic material contains, by total amount, 92-97wt% of Si3N4 and 3-8wt% of Y2O3. The method comprises the steps as follows: (1) the raw material is prepared; (2) a second mixture is fed into an injection molding machine for molding after granulation so as to form the required shape of the sensor shell; and (3) a binder in the product of the step (2) is removed, and the sensor shell is manufactured by sintering in nitrogen or inert gas atmosphere. The sensor shell has the advantages of high hardness, heat insulation, high-temperature resistance and electrical insulation, and can fully reduce the influence of heat, cold, electricity and impact on the sensor.

Description

technical field [0001] The invention belongs to the field of electronic equipment, and relates to a sensor shell and a manufacturing method thereof, in particular to a proximity switch sensor shell and a manufacturing method thereof. Background technique [0002] Proximity switch sensors generally include a sensor housing, and electronic components such as PCB boards, coils, and magnetic cores installed in the sensor housing. The sensor housing is a key part of a sensor, which determines the environment in which the sensor is suitable. In some applications, proximity switch housings must withstand and protect the internal electronic components from heat, cold, electricity, humidity and shock. At present, the housing of most sensors is made of plastic, or metal such as stainless steel and copper. The internal components of the sensor are inserted into the housing, and then filled with epoxy resin or polymer resin for insulation and protection. [0003] The above-mentioned p...

Claims

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Application Information

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IPC IPC(8): H03K17/945C04B35/584C04B35/622C04B35/632B29C45/00
Inventor 李为韬
Owner CHANGWEI TECH SHENZHEN
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