Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device

A manufacturing method and semiconductor technology, which can be used in semiconductor devices, semiconductor/solid-state device testing/measurement, electric solid-state devices, etc., and can solve problems such as rising manufacturing costs

Inactive Publication Date: 2010-06-30
SOCIONEXT INC
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0035] In order to avoid this problem, a mask for a semiconductor element and a mask for a product are prepared having a specific circuit pattern different from that of a product, which leads to manufacturing cost the rise of

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device
  • Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device
  • Method for sorting semiconductor element, method for fabricating semiconductor device, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0082] A first embodiment of the method for selecting a defect-free semiconductor element according to the present invention will be described with reference to the drawings.

[0083] figure 1 is a flowchart showing the selection process of the semiconductor element in this embodiment.

[0084] In this embodiment, in the wafer processing step 10, a plurality of semiconductor elements are formed on one main surface of a semiconductor substrate (semiconductor wafer).

[0085] Next, protruding electrodes (bumps) are formed on the respective semiconductor elements formed on the semiconductor substrate as terminals for external connection (bump forming step 20 ).

[0086] At this time, an identification bump is provided for at least one semiconductor element formed outside the active area of ​​the semiconductor substrate. The semiconductor element provided with the identification bump was used as a reference semiconductor element.

[0087] Next, each semiconductor element forme...

no. 2 example

[0138] A second embodiment of the method for selecting a non-defective chip according to the present invention will be described with reference to the drawings.

[0139] In this embodiment, a plurality of semiconductor elements are used, and the bumps 261 for identification are arranged for each semiconductor element, wherein a part of the semiconductor element is included in the effective area of ​​the above-mentioned semiconductor substrate (enclosed by the dotted circle ES). region), while the other part is outside the valid region.

[0140] This embodiment is characterized by the arrangement structure of the bumps on the plurality of non-product semiconductor elements (non-product semiconductor chips) and the utilization method of the plurality of non-product semiconductor elements (non-product semiconductor chips).

[0141] That is, if Figure 9A As shown, a plurality of semiconductor elements (non-productized semiconductor chips) are partly included in the effective are...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for sorting and acquiring semiconductor element is provided for picking up a defect free (acceptable) semiconductor element effectively and surely from a plurality of semiconductor elements (semiconductor chips) formed on a semiconductor substrate (semiconductor wafer). A method for fabricating a semiconductor device and a semiconductor device are also provided. The method for sorting and acquiring semiconductor element comprises a step for arranging a plurality of semiconductor elements in the effective region of a semiconductor substrate, a step for arranging a reference semiconductor element on the outside of the effective regionof the semiconductor substrate, a step for forming bumps on the plurality of semiconductor elements and the reference semiconductor element, a step for testing the plurality of semiconductor elements in the effective region, a step for forming an arrangement map starting from the reference semiconductor element, and a step for picking up a semiconductor element judged as acceptable in the test among the plurality of semiconductor elements.

Description

technical field [0001] The present invention relates to a selection method capable of efficiently and reliably selecting a defect-free (defective product) semiconductor element from a plurality of semiconductor elements (semiconductor chips) formed on a semiconductor substrate (semiconductor wafer), a semiconductor device and its manufacture method. Background technique [0002] In recent years, in the manufacture of semiconductor devices, it is desired to obtain more semiconductor elements (semiconductor chips) from one semiconductor substrate (semiconductor wafer) in order to mass-produce them and reduce their manufacturing costs. [0003] Therefore, depending on the type and specification of the semiconductor element, thousands or more semiconductor elements may be obtained from one semiconductor substrate. [0004] On the other hand, along with the miniaturization and weight reduction of electronic equipment on which the semiconductor devices are mounted, the thickness ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L24/11H01L2924/014H01L22/20H01L24/05H01L2224/05001H01L2224/05022H01L2224/05572H01L2224/056H01L2924/00014H01L2224/05099
Inventor 金野吉人山田豊
Owner SOCIONEXT INC