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Broad-width multi-layer compound package material joint device and method

A multi-layer composite and packaging material technology, which is applied in the field of packaging paper manufacturing, can solve the problems of large heat-sealing thickness, etc., and achieve the effect of ensuring reliability and safety, ensuring uniformity, and protecting the cylinder

Active Publication Date: 2012-02-29
SHANGHAI JIELONG INDAL GROUP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a wide-width multi-layer composite packaging material joint device and method to solve the problem of heat-sealing composite materials with large thickness in the prior art

Method used

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  • Broad-width multi-layer compound package material joint device and method
  • Broad-width multi-layer compound package material joint device and method

Examples

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Embodiment 1

[0021] Such as figure 1 and figure 2 Shown, a kind of splicing device of wide-width multi-layer composite packaging material comprises casting 1 (knife body), paper pad 2 (insulation pad), heating block 3, aluminum block 1 4 (heat-sealing knife 1), high-temperature cloth 5 , high temperature soft strip 6, aluminum block II 7 (heat sealing knife II), adjustment nut 8 and positioning pin 9, described adjustment nut 8 is connected with casting 1 (knife body), paper pad 2, heating block successively from top to bottom 3. Aluminum block I 4 (heat-sealing knife I), and located in the upper part of the device, the high-temperature flexible strip 6 is located directly below the aluminum block I 4 (heat-sealing knife I), and its bottom is connected with aluminum block II 7 (Heat Sealing Knife II).

[0022] The cross-sectional shape of the casting 1 (knife body) is "concave".

[0023] Described aluminum block 14 (heat-sealing knife 1) outsourcing high-temperature cloth 5.

[0024] ...

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PUM

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Abstract

The invention relates to a broad-width multi-layer compound package material joint device and a method. A regulation screw nut (8) is sequentially connected with a knife body of a casting (1), a heat insulation pad (2), a heating block (3) and an aluminum block I heat sealing knife (4) from top to bottom, and is positioned at the upper part of the middle of the device, an aluminum block II heat sealing knife (7) is positioned right under the aluminum block I heat sealing knife (4), and is connected with a bottom fixed device, a Teflon high-temperature cloth (5) is covered outside the aluminum block I heat sealing knife (4) and is used as a heat insulation device, and the upper surface of the aluminum block II heat sealing knife (7) is provided with a silicon rubber high-temperature resistance strip (6) to be used as a heat insulation device. The method comprises the following process flows in sequence: unreeling new rolls of composite materials, lapping and overlapping new rolls of materials and old rolls of materials, clamping and fixing two layers of materials, heating a hot sealing knife and tightly clamping the hot sealing knife for hot sealing and releasing. The invention can solve the problem of the hot sealing of composite materials with large thickness in the prior art.

Description

technical field [0001] The invention belongs to the field of wrapping paper manufacturing, and in particular relates to a joint device and method for wide-width multi-layer composite packaging materials. Background technique [0002] Multi-layer composite packaging material is composed of cardboard, aluminum foil, and multi-layer plastic. It is characterized by a very thick thickness of 300-500mm and a width of 1.4m. It uses the general heat sealing technology-ultrasonic high frequency method It is difficult to achieve the effect of tight sealing joint. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a wide-width multi-layer composite packaging material joint device and method, so as to solve the problem of heat-sealing composite materials with large thickness in the prior art. [0004] The technical scheme adopted by the present invention to solve its technical problems is: provide a kind of wide-width multi-la...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D21H27/10B65D65/40
Inventor 沈伟荣
Owner SHANGHAI JIELONG INDAL GROUP