Combined-type self-expansion package body and manufacturing method thereof

A manufacturing method and self-expanding technology, applied in the direction of bonding methods, record carriers used by machines, instruments, etc., can solve the problems of ignoring the convenience of removal, achieve the effect of convenient recycling and improve convenience

Active Publication Date: 2010-07-28
上海杰远环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the RFID electronic tag is recycled, the RFID electronic tag must be removed from the target object, and the existing bonding method only focuses on the firmness of the connection, while ignoring the convenience of removal

Method used

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  • Combined-type self-expansion package body and manufacturing method thereof
  • Combined-type self-expansion package body and manufacturing method thereof
  • Combined-type self-expansion package body and manufacturing method thereof

Examples

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specific Embodiment 1

[0043] ginseng image 3 As shown, this figure shows a specific embodiment of the structure of a composite self-expanding package 100, the composite self-expanding package 100 includes a foam material A 110, and is arranged on the periphery of the foam material A110 The foam material A coating layer 120 of the foam material A coating layer 120, the foam material B 130 disposed on the periphery of the foam material A coating layer 120, and the foam material B coating layer 140 disposed on the periphery of the foam material B 130. In this embodiment, the foaming substance A 100 is selected from HCl solution, and the foaming substance A coating layer 120 is realized by using a polyethylene plastic film; corresponding to the foaming substance A 100, the HCl solution is selected, and the foaming substance B 130 is selected from NaHCO 3 Powder, foam material B coating layer 140 is realized by polyethylene plastic film.

[0044] In this embodiment, the manufacturing method of the com...

specific Embodiment 2

[0046] ginseng Figure 4 As shown, this figure shows a specific embodiment of the structure of a composite self-expanding package 100, the composite self-expanding package 100 includes a foam material A 110, and is arranged on the periphery of the foam material A110 The foam material A coating layer 120 of the foam material A coating layer 120, the foam material B 130 disposed on the periphery of the foam material A coating layer 120, and the foam material B coating layer 140 disposed on the periphery of the foam material B 130. In this embodiment, dilute sulfuric acid solution is selected for foaming substance A 100, and polyvinyl chloride plastic film is used for foaming substance A coating layer 120; corresponding to foaming substance A 100, dilute sulfuric acid solution is selected for use, and foaming substance B130 is selected CaCO 3 Powder, foam material B coating layer 140 is realized by polyethylene plastic film.

[0047] In this embodiment, the manufacturing method...

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Abstract

The invention provides a combined-type self-expansion package body and a manufacturing method thereof, belonging to the bonding technology application field. The combined-type self-expansion package comprises a foaming substance A, a coating layer of the foaming substance A, a foaming substance B and a coating layer of the foaming substance B. The manufacturing method comprises the following steps: packaging the foaming substance A; packaging the foaming substance B outside the coating layer of the foaming substance A; and packaging the coating layer of the foaming substance B outside the foaming substance B. The radio frequency identification (RFID) can be bonded or removed conveniently by adopting the package body, thereby facilitating RFID circulation utilization.

Description

technical field [0001] The invention belongs to the application field of bonding technology, in particular to the bonding technology of electronic devices. Background technique [0002] Radio Frequency Identification (RFID) is a non-contact automatic identification technology. It automatically identifies target objects and obtains relevant data through radio frequency signals. The identification work does not require manual intervention and can work in various harsh environments. RFID technology is generally known and can be used in a variety of applications, such as managing inventory, electronic access control, security systems, automatic vehicle identification on toll roads, and electronic item surveillance. [0003] Existing RFID chips are generally pasted on the target article or product by means of an adhesive layer. For example, a Chinese patent (authorized announcement number CN200986778Y) provides an adhesive label with an RFID chip, which is placed on the self-adhe...

Claims

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Application Information

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IPC IPC(8): C09J5/00G06K19/067
Inventor 马宇尘
Owner 上海杰远环保科技有限公司
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