Light-emitting diode (LED) fluorescent glue

A technology of fluorescent glue and silica gel, which is applied in the field of LED fluorescent glue and phosphor powder preparation, which can solve the problems of low effective conversion efficiency of phosphor powder, large light decay, and poor luminous stability.

Inactive Publication Date: 2010-07-28
ANHUI ZERUN OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effective conversion efficiency of phosphors used in this method is low, especially the efficiency of red phosphors needs to be greatly improved
[0006] The third implementation method is to coat phosphors of three primary colors or multiple colors on the purple or ultraviolet LED chip, and use the long-wave ultraviolet light (370nm-380nm) or purple light (380nm-410nm) emitted by the chip to excite th...

Method used

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  • Light-emitting diode (LED) fluorescent glue

Examples

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Embodiment Construction

[0037] In order to further describe the present invention, the LED fluorescent glue of the present invention will be further described below in conjunction with examples.

[0038] According to the components and contents (% by weight) listed in Table 1, the LED fluorescent glue was prepared. All components are commercially available.

[0039] Table 1 LED fluorescent glue components and content (100% by weight)

[0040]

Example

1

Example

2

Example

3

Example

4

Example

5

OE-6450A (silicone main agent)

3.10

3.40

3.24

3.1

3.20

OE-6450B (silicone curing agent)

2.90

2.80

2.76

2.6

2.75

TO powder (diffusion agent)

73.81

72.8

74.1

75.54

74.2

Silica powder (SiO 2 )

6.4

7.0

6.7

6.3

6.75

Aluminum oxide powder (Al 2 o 3 )

11.8

11.76

11.2

10.6

11.0

ST-11001 (Silicone) ...

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Abstract

The invention discloses an LED fluorescent glue prepared from the following components (by the total weight of 100%): 3.10%-3.40% of OE-6450A (silica gel main agent), 2.60%-2.90% of OE-6450B (silica gel curing agents), 72.80%-75.54% of TO powder (dispersing agents), 6.3%-7.0% of silicon dioxide powder (SiO2), 10.6%-11.8% of aluminum oxide powder (Al2O3), 1.4%-1.7% of ST-11001 (silica gel), 0.28%-0.32% of JZ-520A (glue main agent) and 0.18%-0.22% of JZ-520B (glue curing agents). The invention can effectively excite the light spots of finished products and improve the confidence degree of finished products, has the advantages of low cost and convenient use, and can be used for preparing fluorescent powder for white-light LED elements.

Description

technical field [0001] The invention relates to an LED bonding material, in particular to an LED fluorescent adhesive, which can be used to prepare fluorescent powder for LAMP white LED components. Background technique [0002] In recent years, the most interesting event in the field of lighting is the rise of semiconductor lighting. In the mid-1990s, through unremitting efforts, Nakamura and others from Nichia Chemical Corporation of Japan broke through the key technology of manufacturing blue light-emitting diodes (LEDs), and thus developed the technology of covering blue LEDs with fluorescent materials to produce white light sources. Semiconductor lighting has the characteristics of green environmental protection, long life, high efficiency and energy saving, resistance to harsh environments, simple structure, small size, light weight, fast response, low working voltage and good safety, so it is known as the successor to incandescent lamps, fluorescent lamps and energy-sa...

Claims

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Application Information

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IPC IPC(8): C09K11/02
Inventor 孟杰陈和生包书林
Owner ANHUI ZERUN OPTOELECTRONICS
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