Light-emitting diode (LED) fluorescent glue

Abstract

The invention discloses an LED fluorescent glue prepared from the following components (by the total weight of 100%): 3.10%-3.40% of OE-6450A (silica gel main agent), 2.60%-2.90% of OE-6450B (silica gel curing agents), 72.80%-75.54% of TO powder (dispersing agents), 6.3%-7.0% of silicon dioxide powder (SiO2), 10.6%-11.8% of aluminum oxide powder (Al2O3), 1.4%-1.7% of ST-11001 (silica gel), 0.28%-0.32% of JZ-520A (glue main agent) and 0.18%-0.22% of JZ-520B (glue curing agents). The invention can effectively excite the light spots of finished products and improve the confidence degree of finished products, has the advantages of low cost and convenient use, and can be used for preparing fluorescent powder for white-light LED elements.

Description

technical field [0001] The invention relates to an LED bonding material, in particular to an LED fluorescent adhesive, which can be used to prepare fluorescent powder for LAMP white LED components. Background technique [0002] In recent years, the most interesting event in the field of lighting is the rise of semiconductor lighting. In the mid-1990s, through unremitting efforts, Nakamura and others from Nichia Chemical Corporation of Japan broke through the key technology of manufacturing blue light-emitting diodes (LEDs), and thus developed the technology of covering blue LEDs with fluorescent materials to produce white light sources. Semiconductor lighting has the characteristics of green environmental protection, long life, high efficiency and energy saving, resistance to harsh environments, simple structure, small size, light weight, fast response, low working voltage and good safety, so it is known as the successor to incandescent lamps, fluorescent lamps and energy-sa...

AI Technical Summary

Problems solved by technology

However, the effective conversion efficiency of phosphors used in this method is low, especially the efficiency of red phosphors needs to be greatly improved

[0006] The third implementation method is to coat phosphors of three primary colors or multiple colors on the purple or ultraviolet LED chip, and use the long-wave ultraviolet light (370nm-380nm) or purple light (380nm-410nm) emitted by the chip to excite the phosphor powder To achieve white light emission, this method has better color rendering, but it also has problems similar to the second method, and the current red and green phosphors with high conversion efficiency are mostly sulfide systems, which have poor luminescence stability. , The light decay is large, so the development of high-efficiency, low light decay phosphors for white LEDs has become an urgent task

Images