Sucker type silicon slice taking mechanism

Abstract

The invention relates to a sucker type silicon slice taking mechanism which comprises a stander, lifting devices installed on the stander, a movable sucker device and a silicon slice conveying device, wherein the stander is provided with an upper table plate and a lower table plate; the two lifting devices are installed on the lower table plate, are respectively arranged at left and right and areused for lifting overlapped silicon slices according to the specified distance; the movable sucker device is installed on the upper table plate, corresponds to the lifting device and is used for sucking the silicon slice on the lifting device left and right alternately and putting the silicon slices on the silicon slice conveying device alternately; and the silicon slice conveying device is arranged on the lower table plate, is positioned between the left and the right lifting devices, and is used for outputting the silicon slices sucked by the movable suction cup device. The sucker type silicon slice taking mechanism is simple in structure, ingenious and reasonable as well as high in degree of automation and silicon slice taking efficiency, can ensure the output silicon slices to have equal interval and same direction and to be arranged in sequence, and reduces the fault rate of the silicon slices.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer production, and relates to a device that takes out neatly stacked silicon wafers one by one, and places them on a conveyor belt to transport them out, so as to cooperate with the circulation of silicon wafers in the process of processing and production, specifically The utility model relates to a sucker type silicon wafer taking mechanism. Background technique [0002] During the production process of solar silicon wafers, the neatly stacked silicon wafers need to be taken out one by one and placed on the conveyor belt to be transported out to cooperate with the subsequent production steps. In the prior art, this operation is usually manual, that is, the staff uses a simple suction cup to suck silicon wafers, and then places the sucked silicon wafers one by one on the conveyor belt to be transported out. The disadvantage of this kind of operation is: the operation of picking up the sl...

AI Technical Summary

Problems solved by technology

The disadvantage of this kind of operation is: the operation of picking up the slices is inconvenient, it is easy to cause the silicon wafers to drop, bruise, and the damage rate of the silicon slices is high; The intervals between the slices are not equal and the arrangement is uneven; manual operation is labor-intensive, requires a lot of manpower, and is unstable

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