Chip image collecting and locating device based on rotary reflector

Abstract

The invention discloses a chip image collecting and locating device based on a rotary reflector, relating to an image collection device. The invention aims to solve the problems that image distortion and image deformation occur in the traditional chip motion image collection process, and the chip stops once in the process of moving to an appointed patching position based on a certain path to cause low work efficiency of mounting the chip. When the chip is mounted, a suction nozzle moves downwards firstly to an M position to suck the chip; a mobile motor reversely rotates, the suction nozzle carries the chip to move upwards to an N position, a mobile base drives a rack to move upwards when moving upwards, a gear drives a reflector component to rotate, the lateral end of the reflector component rotates from a point A to a point B, lights of a light source shines on the reflector, a camera obtains a static image of the chip through the reflector, the image is treated by a computer, and the position error of the chip relative to a center coordinate system of the suction nozzle is obtained; and the motor is started to rotate, the suction nozzle rotates, and correction of chip angle error is finished. The invention is used for mounting the chip.

Description

technical field [0001] The invention relates to an image acquisition device. Background technique [0002] In modern electronic manufacturing equipment, the volume of chips is becoming smaller and the degree of chip integration is increasing. It is difficult to achieve high-precision positioning by using traditional operations such as mechanical clamping for chip integration. Therefore, the precision positioning of electronic components and installation stations requires This is done by acquiring images of the component in motion. In the process of electronic manufacturing, the chip integration operation generally uses the suction nozzle to pick up the chip components, and then moves to the designated placement position according to a certain path to perform the placement operation. The nozzle center coordinate system will produce a position error, which includes Δx, Δy, Δθ, where Δx is the X-axis error between the chip center and the nozzle center; Δy is the Y-axis between...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the acquisition of the existing chip moving image using the single-mirror method, the double-mirror method and the half-mirror method, all of which will cause image distortion, require automatic focus, and image distortion. At the same time, the chip In the process of moving to the designated patch position according to a certain path, it needs to stop once in the middle, which leads to the problem of low work efficiency of chip placement. A chip image acquisition and positioning device based on a rotating mirror is provided.

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