Film for machining wafer

Abstract

This invention provides a film for machining wafer (10) which can effectively restrain the transfer print trace to the adhesives layer (12) by means of simple structure without increasing the material cost or manufacturing process. Cutting the labeling part (13a) of the film for machining wafer as followed form in advance: the operation is performed at least in the periphery transfer print section(13d) overlapped with said adhesives layer (12) when the film for machining wafer (10) being winded in the form of roller shape, therefore, the overall length of the periphery transfer print section(13d) is longer than that of the periphery transfer print section of arc length having a radius of r when the shortest distance from the center or the adhesives layer (12) to said periphery transfer print section(13d) is set as r.

Description

technical field [0001] The present invention relates to a dicing / die used in the dicing / die bonding process for use in two processes of a semiconductor wafer dicing process and a die bonding process for attaching the diced chip to a lead frame or other chip In particular, the soldering film relates to a film for wafer processing in which a plurality of dicing / die bonding films are continuously laminated on a long release film. Background technique [0002] In the manufacturing process of semiconductor manufacturing equipment such as ICs, a process of cutting (dicing) the semiconductor wafer in units of chips after attaching a dicing / die-bonding film to the back surface of a semiconductor wafer on which a circuit pattern is formed, picking up the cut chips (Pick up) process, and the die bonding (mounting) process of bonding the picked-up chip to a lead frame or a package substrate, etc., or stacking and bonding semiconductor wafers on a build-up package substrate, etc. [00...

AI Technical Summary

Problems solved by technology

[0013] However, in the above-mentioned adhesive sheet of Patent Document 1, the support layer is formed on a part other than the adhesive layer and the adhesive film necessary in the case of manufacturing a semiconductor device on the peeling substrate, so the width of the support layer There is a problem that the width of the support layer is narrow relative to the outer diameter of the adhesive layer and adhesive film, and the effect of suppressing transfer marks is insufficient.

In addition, the support layer usually does not have adhesiveness and is not sufficiently adhered to the release base material (PET film). Therefore, in the narrowest part of the support layer, it is lifted from the release base material, and it is wound up and attached to the wafer. The problem that the transport roller of the tape loading machine used in the process of cutting and die-bonding film caused the machine to stop

[0014] In addition, it is also considered to increase the width of the support layer, but the overall width of the wafer processing belt also becomes wider, so it is difficult to use existing equipment.

In addition, since the support layer is a part that is finally discarded, the increase in the width of the support layer leads to an increase in material cost.

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