Light-emitting diode packaging structure and manufacture method thereof

A technology of light-emitting diodes and packaging structures, which is applied to light sources, lighting devices, point light sources, etc., can solve the problem of uneven distribution of fluorescent materials and achieve the effect of optimal light uniformity.

Inactive Publication Date: 2010-09-15
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The object of the present invention is to provide a light-emitting diode packaging structure and its manufacturing method, which are used to improve th

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  • Light-emitting diode packaging structure and manufacture method thereof
  • Light-emitting diode packaging structure and manufacture method thereof
  • Light-emitting diode packaging structure and manufacture method thereof

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[0046] In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and understandable, the following embodiments are specifically described in conjunction with the accompanying drawings.

[0047] figure 2 It is a schematic cross-sectional view of a light emitting diode packaging structure according to an embodiment of the present invention. Please refer to figure 2 In this embodiment, the light emitting diode packaging structure 100 includes a carrier 110, a light emitting diode chip 120, a first packaging glue 130, a second packaging glue 140, and a housing 150. In particular, the light emitting diode packaging structure 100 of this embodiment is a surface mount (SMD) light emitting diode packaging structure 100.

[0048] In detail, the housing 150 is disposed on the carrier 110 and covers a part of the carrier 110, wherein the housing 150 and the carrier 110 form a cavity C1. The LED chip 120 is disposed on the carrier ...

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Abstract

The invention relates to a manufacture method of a light-emitting diode packaging structure, which comprises the steps of: firstly, providing a loader and a light-emitting diode chip, wherein the light-emitting diode chip is configured on the loader and is positioned in a pit; secondly, filling a first packaging colloid in the pit, wherein the first packaging colloid covers the light-emitting diode chip, a fluorescent material is doped in the first packaging colloid; thirdly, carrying out first roasting to enable the first packaging colloid to be in a semi-curing state; and fourthly, filling a second packaging colloid in the pit, wherein the second packaging colloid covers the first packaging colloid.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure and a manufacturing method thereof, and in particular to a light emitting diode packaging structure and a manufacturing method thereof. Background technique [0002] Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various equipment. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have been extended to large outdoor billboards, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions. [0003] figure 1 It is a schematic cross-sectional view of a known surface-mount light-emitting diode packaging structure. Please refer to fi...

Claims

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Application Information

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IPC IPC(8): H01L33/00F21Y101/02
Inventor 辛嘉芬
Owner EVERLIGHT ELECTRONICS
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