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High-power professional audio power amplifier based on Peltier effect radiation technology

A Peltier effect, audio power technology, applied in power amplifiers and other directions, can solve problems such as the pipe-fin heat dissipation structure is not suitable for audio power amplifiers, high manufacturing costs, and increased difficulty in the micro-channel heat dissipation process, to improve cooling. Efficiency, unlocking cooling bottlenecks, and the effect of reducing usage

Inactive Publication Date: 2010-10-13
叶真
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the passive heat dissipation structure using copper or aluminum alloy seems to be stretched to solve the above problems. The pipe-fin heat dissipation structure is not suitable for professional audio power amplifier products, and the micro-channel heat dissipation increases the manufacturing cost due to the increase in process difficulty.

Method used

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  • High-power professional audio power amplifier based on Peltier effect radiation technology
  • High-power professional audio power amplifier based on Peltier effect radiation technology
  • High-power professional audio power amplifier based on Peltier effect radiation technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1, see image 3 , the bottom of the base of the radiator 1 is provided with a groove, the semiconductor cooling chip 5 is sheet-shaped, and placed in the groove, and placed in the gap between the groove wall and the semiconductor cooling chip 5 The silica gel 8 that acts as heat insulation, the back of the power amplifier chip 4 is coated with thermally conductive silicone grease and then pasted on the cold end surface of the semiconductor refrigeration chip 5 .

Embodiment 2

[0020] Example 2, see Figure 4 , is the further optimization of embodiment 1, and the purpose is to further improve the heat dissipation effect. On the basis of embodiment 1, an inner cooling fan 20 is also respectively arranged at the ends of the multi-piece cooling fins 62 of the two radiators 6 , the inner cooling fan 20 is located between the radiator 6 and the outer cooling fan 10 . The specific fixing method is: a fixed plate 63 is fixed on the outer wall of the radiator 6, and the fixed plate 63 surrounds a plurality of cooling fins, and the two side plates of the fixed plate 63 are respectively fixed on the outer wall of the radiator 6 by screws. And the panel between the two side plates of the fixed plate 63 is provided with a mounting hole, and the inner cooling fan 20 is housed in the hole, and the inner cooling fan 20 is perpendicular to the cooling fins, and can be placed in the gap between the cooling fins. Blow the air to dissipate the heat on the heat sink in...

Embodiment 3

[0021] Example 3, see Figure 5 On the side wall of the base of the heat sink 1, a sheet-shaped semiconductor cooling chip 5 is fixed, and the cold end surface of the semiconductor cooling chip 5 is bonded to the power amplifier chip; the back of the power amplifier chip 4 is coated with thermally conductive silicone grease Finally, it is fixed on the hot end surface of the semiconducting cooling sheet 5. Two sets of power amplification chips 4 and semiconductor cooling chips 5 are fixed on the side wall of the base of the radiator 1 .

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Abstract

The invention discloses a high-power professional audio power amplifier based on a Peltier effect radiation technology, comprising a box body, a left power amplification channel and a right power amplification channel. The left power amplification channel and the right power amplification channel are arranged in the box body and respectively provided with at least one power amplification chip, a semiconductor heat radiation sheet and a heat radiator which are fixed together from front to back, the semiconductor heat radiation sheet is provided with a hot end surface and a cold end surface, the hot end surface of the semiconductor heat radiation sheet is pasted on the heat radiator to from hot joint, the back of the power amplification chip is pasted with thermally conductive silicone and pasted on the cold end surface of the semiconductor heat radiation sheet, and outer heat radiation fans capable of taking away heat which is transferred to the heat radiator are respectively arranged in positions corresponding to the left power amplification channel and the right power amplification channel on the rear backboard of the box body. The invention has good heat radiation performance and high efficiency.

Description

[technical field] [0001] The invention relates to a high-power professional audio power amplifier based on Peltier effect heat dissipation technology. [Background technique] [0002] With the development of industry technology, there are currently two trends in professional audio power amplifiers: 1. The output power of professional audio power amplifiers is getting larger and larger, and thousands of speakers are often configured in large venues; 2. In order to pursue more perfect sound quality , the power reserve is correspondingly larger and larger. [0003] Both of these trends pose serious challenges to the technical specifications of existing power tubes, especially the ability to withstand power tubes and the temperature rise caused by power dissipation. Therefore, the overall heat dissipation of professional audio power amplifiers is very meaningful for solving the above problems. Maximum cooling can improve various indicators of professional audio power amplifiers,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F3/20
Inventor 叶真
Owner 叶真
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