Envelope for luminous elements of semiconductor in large power

Abstract

The disclosed package includes following parts and structures: at least one inner and outer connected LED chip electrically; LED base plate and at least more than one LED chips, and each LED chip is fixed on front face of base plate; underside of base plate is jointed to electronic refrigerating chip in semiconductor; the refrigerating chip possesses a cold end and a heat end; the cold end is jointed to the underside of base plate, and the heat end is formed thermal contact to thermolysis bottom seat. Comparing with packaging technique in passive thermolysis mode such as traditional thermal fins and heat pipe etc, the disclosed package absorbs a great lot quantity of heat generated from semiconductor luminescence chip in large power forwardly and quickly so as to provide thermolysis channel in high performance between LED luminescence chip and radiating carrier.

Description

technical field [0001] The invention relates to the package of high-power semiconductor light-emitting element LED, in particular to a package structure for effectively dissipating the heat generated during the operation of the semiconductor light-emitting element LED. Background technique [0002] The application of high-power and high-brightness LEDs (light-emitting diodes) continues to expand, first entering the field of special lighting, and moving towards general lighting. As the output power of LED chips continues to increase, higher requirements are put forward for the packaging structure of high-power LEDs. The traditional LED packaging structure generally uses conductive or non-conductive glue to mount the chip in a small-sized reflective cup or on a carrier table, and then encapsulates it with epoxy resin after completing the internal and external connections of the device with gold wire. If the high-power LED adopts the traditional LED packaging structure, the ch...

AI Technical Summary

Problems solved by technology

Chinese patent specification CN 1664433A discloses a method of heat dissipation using heat pipes. Compared with ordinary heat sinks, the thermal resistance of heat dissipation has been reduced. However, due to the large volume of heat pipes, the design of heat sinks is limited by the shape of heat pipes. Due to LED The contact area between the light-emitting chip and the heat dissipation carrier is objectively quite small, and the heat of the LED is passively conducted through the convection of the heat pipe, so the heat dissipation efficiency has not been completely improved, and the structure of the heat pipe requires a large volume, which affects the actual application.

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