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Wafer transmission set for special equipment of semiconductor

A technology of special equipment and transmission device, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc. Effect

Inactive Publication Date: 2012-08-29
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a wafer transfer device for semiconductor special equipment, to solve the technical problems of low reliability and complex structure of traditional wafer grabbing devices

Method used

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  • Wafer transmission set for special equipment of semiconductor
  • Wafer transmission set for special equipment of semiconductor
  • Wafer transmission set for special equipment of semiconductor

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Embodiment Construction

[0016] The present invention will be described in further detail below with reference to the accompanying drawings.

[0017] as attached figure 1 , 2 , Shown in 3, 4, be that this semiconductor special-purpose equipment of an embodiment of the present invention uses wafer transmission device, its angle plate frame 11 and threaded cylindrical pin 9 are fixed on the swing arm 12, wherein angle plate frame 11 is provided with slotted hole 17 , the fixing screw passes through the slot hole 17 to fix the angle plate frame 11 on the swing arm 12, the spring clip fixing plate 10 is fixed on the angle plate frame 11, the other end of the threaded cylindrical pin 9 is threadedly connected with the upper spring pad 1, and the spring hook 8 is installed on the upper spring pad 1, and an elastic device (such as a spring, etc.) for controlling the relative distance between the upper spring pad 1 and the swing arm 12 is arranged between the spring clip fixing plate 10 and the spring hook 8...

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Abstract

The invention discloses a wafer transmission set for special equipment of a semiconductor, which comprises a wafer adsorbing, lifting and cushioning device and a rotary system of a swinging arm, and also comprises a lifting, cushioning and adsorbing platform and the swinging arm which is adjustably connected with the lifting, cushioning and adsorbing platform, wherein the lifting, cushioning and adsorbing platform comprises a wafer adsorption platform (7), an upper and a lower spring pads (1 and 6), a small shaft (3), a spring (4), a sliding sleeve (5) and a small shaft lock nut (2) which are assembled together, the contact surface of the spring lower pad (6) and the wafer adsorption platform (7) is provided with an annular concave air path (14), concentric annular grooves (15) are uniformly distributed on the lower surface of the wafer adsorption platform (7), and the lower surface of the wafer adsorption platform (7) is provided with two vertical radial grooves (16) which are communicate with each annular groove (15). The device has the characteristics of ingenious and compact structure, simple installation, convenient application and low cost, and can be widely applied on transmission of the wafer for the special equipment of the semiconductor.

Description

technical field [0001] The invention relates to an automatic wafer transfer device for semiconductor special equipment, the thickness of which transfers silicon wafers can reach 50 microns. Background technique [0002] In the manufacturing process of special semiconductor equipment, it is a key technology to realize the automatic picking, placing and automatic transmission of silicon wafers. In modern production equipment, the common devices for grabbing wafers are: clamping type, electromagnetic adsorption type, vacuum suction cup adsorption type, etc. Among them, the clamping wafer grabbing device is easy to cause damage to the wafer, and the electromagnetic adsorption wafer grabbing device and the vacuum chuck adsorption wafer grabbing device are more complicated in structure, the parts are difficult to process, and there are also problems that are difficult to control. Contents of the invention [0003] The object of the present invention is to provide a wafer transf...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/683
Inventor 杨生荣张文斌张敏杰
Owner CETC BEIJING ELECTRONICS EQUIP