Blowing corrosion machine and method for corrosion and cleaning

Abstract

The invention relates to a blowing corrosion machine and a method for corrosion and cleaning. The blowing corrosion machine is characterized in that an air inlet valve is connected with an air inlet pipe; one end of the air inlet pipe is connected with a coil cylinder, and the other end is communicated with an air chamber A; in processing, wafers are placed to the bottom of a blow bottle and provided with a screen with a cover; the blow bottle is installed on the air chamber A and connected with an air chamber A in a corrosive solution tank through quick-sealing threads; a terminal of a water purifier is connected with one end of a water inlet pipe through a water inlet valve; the other end of the water inlet pipe is communicated with an air chamber B; a waste pipe is connected with an overflow hole on a pure water tank; a steam pipe is connected with an exhaust hole; and a monitoring system is arranged on a control cabinet. The invention has the advantages that during corrosion and cleaning operation, compressed air is controlled through flow, and dispersion of the wafers can not cause lamination and defective products with corrosion marks; because a corrosion bottle is connected with the air chamber through the quick threads, the installation and disassembly operation is convenient and fast; the quantity of loading wafers in a single bottle is increased by 3000pcs than that of a cradle, and the production efficiency is high; and the structure is simple without control of a servo motor.

Description

technical field [0001] The invention relates to a gas blowing etching machine and an etching and cleaning method, which are applicable to the chemical etching process of quartz wafer processing. It specifically involves the device design and manufacture of the process; the design of the processing method; the design of the processing flow, etc. The invention belongs to the technical field of piezoelectric quartz crystal manufacturing. Background technique [0002] At present, traditional cradle etching machines are used in the quartz wafer processing and manufacturing industry. During the production and processing process of this machine, the wafer cannot be completely and effectively freed, which can easily cause poor corrosion marks on the wafer and make the product scrapped. Restricted by this defect, the improvement of the production capacity of this process is greatly restricted, and the fluctuation of product quality is caused. Contents of the invention [0003] T...

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Problems solved by technology

[0003] The present invention aims to overcome the existing technical defects of the existing cradle type etching machine that the wafers cannot be effectively dispersed and dissociated during the processing process; the production capacity is limited (Max: 2000pcs / bottle); it is easy to cause poor corrosion marks on the wafers and the like.

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