Electronic device and method of manufacturing the same
An electronic device and electrode technology, applied in the direction of microelectronic microstructure devices, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of complex structure, cost preservation, and reduced profile
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no. 1 example
[0046] First, refer to Figure 1-4 , a description will be given of the MEMS switch 1 according to the first embodiment. Figure 3A , Figure 3B and Figure 3C respectively along the figure 1 A cross-sectional view of switch 1 taken by lines A-A, B-B and C-C in FIG. Figure 4 is along figure 1 A cross-sectional view of the MEMS switch 1 is taken on line A-A shown in . exist figure 2 In , the solder bump 19 and the film member 20 are not shown.
[0047] refer to Figure 1-Figure 3A , MEMS switch 1 is made up of substrate 11, movable contact electrode 12, stationary contact electrode 13, movable driving electrode 14, stationary driving electrode 15, wall part 17, supporting part 18, solder block 19 and film member 20 etc. .
[0048] Substrate 11 is an SOI (Silicon On Insulator) substrate including three layers, namely, support substrate 11a, intermediate oxide film 11b, and active layer 11c. Support substrate 11a is made of silicon and has a thickness of about 500 μm....
no. 2 example
[0097] After that, a description will be given of the MEMS switch 1B according to the second embodiment. In the second embodiment, only those parts that are different from the first embodiment are described. The same parts as those in the first embodiment are assigned the same reference numerals, and descriptions thereof will not be repeated or will be simplified. This also applies to other embodiments.
[0098] Figure 11 is a front view of the MEMS switch 1 according to the second embodiment. exist Figure 11 In , the MEMS switch 1B is shown after omitting the membrane member.
[0099] exist Figure 11 Among them, the support portions 18Ba and 18Bb have opening portions KA which open above the electrode portions 12a and 14a, respectively. In particular, the support portion 18Ba includes support portion segments 18Ba1 and 18Ba2, and the support portion 18Bb includes support portion segments 18Bb1 and 18Bb2. The support portion segment 18Ba1 is connected to the side por...
no. 3 example
[0103] Furthermore, a description will be given of the MEMS switch 1C according to the third embodiment.
[0104] exist Figure 12 Among them, the supporting portion 18Ca is arranged so that it is connected to the anchor portion 12, and the supporting portion 18Cb is arranged so that it is connected to the anchor portion 14b. Therefore, the support portions 18Ca and 18Cb are made in a shape extending from the signal line. With this arrangement, the support portions 18Ca and 18Cb obtain the same potential applied to the movable contact electrode 12 or the movable drive electrode 14 without being connected to the ground potential.
[0105]In the MEMS switch 1C according to the third embodiment, the parasitic capacitances of the electrode portions 12a and 14a are also reduced, and high-frequency characteristics are improved.
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Abstract
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