Tin soldering alloy and tin soldering conjugant using the same
A joint body and solder technology, applied in the field of solder alloys and solder joint bodies using the solder alloys
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example 1
[0062] Sn, Ag, Al, Sb, Y, and Ge were weighed so as to have the composition shown in Table 1, then melted, and the alloy melts obtained in pairs were poured into a mold to produce a solder alloy, and the following evaluation tests were performed.
[0063] (Evaluation Test 1)
[0064] A borosilicate glass plate (product name TEMPAX) cut into 30 mm square and 3 mm thick was placed on a hot plate heated to 350° C. as a material to be joined, and preheated. Thereafter, using a soldering iron tip to which ultrasonic vibration was applied (ultrasonic welding device SUNBUNDER USM-III manufactured by Kuroda Technology Co., Ltd.), the solder alloy was coated on one surface of the glass plate so that the thickness of the solder alloy became 100 μm, and the Allow to cool slowly. Next, the sample cooled to room temperature was cut with a cutter so that the solder surface of the sample had a grid-like 5×5 grid of 5 mm square, and a peel test piece was produced.
[0065] In order to confi...
example 2
[0083] Weigh Ag, Al, Sb, Y, Ge and Sn, so that it becomes Ag=8.5%, Al=0.35%, Sb=2.0%, Y=0.075%, Ge=0.03%, remaining Partly having a composition of Sn (Al / Sb=0.18), the solder alloy of the present invention was produced by melting in an Ar gas atmosphere, and pouring the resulting alloy melt into a mold. Similarly, in the comparative example, no Sb was added, and a solder alloy in which Ag=8.5%, Al=0.35%, Y=0.075%, Ge=0.03%, and the remainder was Sn was produced in the same manner. The following evaluation tests were performed on the prepared solder alloys.
[0084] (Evaluation Test 1)
[0085] First, a borosilicate glass plate (product name TEMPAX) cut into a 50 mm square and 3 mm thick was placed on a hot plate heated to 350° C. as a material to be joined, and heated in advance. Thereafter, using a soldering iron tip (ultrasonic welding device SUNBUNDER USM-III manufactured by Kuroda Technology Co., Ltd.) to which ultrasonic vibrations were applied, the solder alloy of the ...
example 3
[0098] After weighing Ag, Al, Sb, and Sn so that it becomes Ag=3.5%, Al=0.10%, Sb=1.5% and the remainder being Sn (Al / Sb=0.07), the Melting was carried out in an Ar gas atmosphere, and then the resulting alloy melt was poured into a mold to produce the solder alloy of the present invention. The following evaluation tests were performed on the prepared solder alloys.
[0099] (Evaluation Test 1)
[0100] An alumina plate (manufactured by Nikkato Co., Ltd., product name: SSA-S) cut into 25 mm square and 2.5 mm thick was set on a hot plate heated to 270° C. as a material to be joined, and heated in advance. Thereafter, using a soldering iron tip to which ultrasonic vibrations were applied (ultrasonic welding device SUNBUNDER USM-III manufactured by Kuroda Technology Co., Ltd.), the solder alloy of the present invention was coated on one surface of an alumina plate so that the thickness thereof became 130 μm. Cool slowly in the atmosphere. The surface of the solder applied afte...
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