Substrate cooling method, substrate cooling system and substrate processing device

Abstract

The invention discloses a cooling method for cooling a machined part in a substrate processing device. Under the action of a power device, a recycling cooling gas enters or exits a cooling cavity of the substrate processing device through a first interface or a second interface of the cooling cavity. In a cooling process, the ventilation direction of the recycling cooling gas in the cooling cavity is alternately changed according to a preset time interval. The invention also discloses a cooling system for implementing the cooling method and the substrate processing device comprising the cooling system. The substrate processing device, the cooling system and the cooling method effectively solve the problem of uneven temperatures of the upper surface and the lower surface of the machined part due to the one-way ventilation of the cooling gas in the cooling cavity, improve the cooling effect of the machined part, improve the cooling evenness, effectively shorten the cooling time, improvethe production efficiency, and decrease the production cost.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a cooling method for cooling workpieces in substrate processing equipment. In addition, the present invention also relates to a cooling system for implementing the above method, and a substrate processing equipment including the above cooling system. Background technique [0002] Substrate processing equipment for processing substrates such as semiconductor wafers, flat display panels, and glass panels has been widely used in the field of microelectronic technology. [0003] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a substrate processing equipment. [0004] The substrate processing equipment has a loading platform 11 , a heating chamber 12 , a reaction chamber 13 , a cooling chamber 14 and an unloading platform 15 adjacent in sequence. When the substrate processing equipment is working, driven by the transmission, the substrate 16 p...

AI Technical Summary

Problems solved by technology

Since the gas entering the cooling chamber 24 through the valve 27 is a cooled low-temperature gas, and the temperature of the gas passing through the valve 28 is relatively high, after cooling for a period of time, the temperature of the upper half of the substrate 26 is lower than that of the lower half of the substrate 26. Partial temperature, this has just appeared the phenomenon of uneven cooling of substrate 26 and workpiece 31, and the cooling effect is not good. In order to achieve uniform cooling effect, the cooling time of the system must be increased, which reduces production efficiency and output, and improves production. cost

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