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Bonding material, electronic component, and bonded structure

A technology for joining structures and joining materials, which is applied in the direction of welding/cutting media/materials, electrical components, electrical solid devices, etc., and can solve problems such as poor product quality

Inactive Publication Date: 2010-12-08
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the bonding material 6 bonding the electronic element 4 and the electrode 5 is melted inside the electronic component 1, there is a possibility that the quality of the final product may be defective.

Method used

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  • Bonding material, electronic component, and bonded structure
  • Bonding material, electronic component, and bonded structure
  • Bonding material, electronic component, and bonded structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 2

[0058] The bonding material of the present embodiment contains 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge, 0.02 to 0.11% by weight of Ni, and 89.19 to 97.96% by weight of Bi. The content of Cu is preferably 2 to 6% by weight, the content of Ge is preferably 0.05 to 0.1% by weight, and the content of Ni is preferably 0.05 to 0.08% by weight. Compared with the bonding material of Embodiment 1, the bonding material of this embodiment has higher impact resistance.

[0059] The impact resistance can be evaluated by an experiment in which a 60-g measuring weight is impacted from a height of 180 mm to the side of a chip capacitor having a size of 1.6 mm×0.8 mm.

[0060] When the above impact resistance test was performed using a chip capacitor having a junction of 92.56% by weight Bi-7.4% by weight Cu-0.04% by weight of Ge, the chip capacitor was broken at the junction. Observation of the cross-section of the joint after fracture revealed that the fracture occurred at ...

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Abstract

Disclosed is a bonding material containing 2-10.5% by weight of Cu, 0.02-0.2% by weight of Ge and 89.3-97.98% by weight of Bi, which has heat resistance to 275 DEG C and excellent wettability.Also disclosed is a bonding material containing 2-10.5% by weight of Cu, 0.02-0.2% by weight of Ge, 0.02-0.11% by weight of Ni and 89.19-97.96% by weight of Bi, which has more excellent heat resistance.

Description

technical field [0001] The present invention relates to a lead-free bonding material (solder material), an electronic component using the bonding material, and a bonding structure. A bonding material that is heated and melted when bonding electronic components and substrates. technical background [0002] In recent years, interest in the protection of the global environment has been increasing, and there is concern that lead may be leached into soil from wastes using solder materials. Therefore, as a countermeasure against environmental problems, the development of lead-free solder materials that do not contain lead is being promoted, and lead-free solder materials with high heat resistance are attracting attention in particular. [0003] As a high heat-resistant lead-free solder material, internal bonding of electronic components such as power transistors is typical. Such as Figure 10 As shown, the electronic component 1 has an electronic element 4, an electrode 5, and a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C12/00H01L21/52
CPCH01L2924/01032B23K35/264H01L2224/29113H01L2924/01082H01L2924/0105H01L2924/01004H01L2224/32245H01L2924/01002H01L2924/15747H01L23/49513H01L2924/01322H01L2924/01029H01L2224/29111H01L2924/0132H01L2924/19041H01L2924/01028C22C12/00H01L2224/48091H01L2924/014H01L2924/01013H01L2224/29101H01L2924/01003H01L2924/0134H01L2924/0665H01L2924/0001H01L2224/2919H01L24/45H01L2924/10272H01L2924/01047H01L2924/0133H01L2924/01079H01L24/48H01L2224/838H01L2224/48247H01L24/83H01L2924/01033H01L24/29H01L2924/01005H01L2924/01006H01L2924/01074H01L2924/10253H01L2924/01014B23K2201/36H01L2224/45144H01L2224/73265H01L2924/01051H01L2924/181B23K2101/36H01L2924/00014H01L2924/00H01L2924/01083H01L2924/3512H01L2224/29099H01L2924/00012
Inventor 古泽彰男坂口茂树末次宪一郎
Owner PANASONIC CORP
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