Crystal block slicing method

Abstract

The invention relates to the technical fields of crystal block slicing and silicon slice preparation, in particular to a crystal block slicing method. The method comprises the following steps of: putting a silicon block to be sliced into a slicer, forming a certain included angle between the sliced surface of the silicon block to be sliced with a slicing wire mesh, and when the slicing wire mesh slices, forming point contact of steel wires in the slicing wire mesh with the side edge of the sliced surface of the silicon block. The method avoids the line contact of a single steel wire with the surface of the crystal block when the steel wires just contact the surface of the crystal block during slicing, the single steel wire forms the point contact with the surface of the crystal block, the contact area is small, the steel wires are easy to slice into the crystal block, and the slipping phenomenon when the line-contact steel wires slice the surface of the crystal block is completely avoided.

Description

technical field [0001] The invention relates to the technical field of crystal block slicing and silicon wafer preparation, in particular to a crystal block slicing method. Background technique [0002] At present, when slicing single crystal and polycrystalline ingots, usually before the ingot enters the slicing machine for slicing, the ingot is first glued to the surface of the crystal support in parallel, and at the same time, two or two More than one guide bar, through the guiding and fixing effect of the guide bar on the steel wire, minimize the steel wire when slicing. When the steel wire just touches the surface of the crystal block, since any single steel wire is parallel to the surface of the crystal block, they are all in line contact, and the contact area is large. As a result, the steel wire slips on the entry-cut surface. However, this cutting process cannot completely solve the phenomenon that the steel wire slips on the entry-cut surface. During the slicing pr...

AI Technical Summary

Problems solved by technology

[0002] At present, when slicing single crystal and polycrystalline ingots, usually before the ingot enters the slicing machine for slicing, the ingot is first glued to the surface of the crystal support in parallel, and at the same time, two or two More than one guide bar, the guide bar guides and fixes the steel wire as much as possible to reduce the steel wire when slicing. When the steel wire just touches the surface of the crystal block, since any single steel wire is parallel to the surface of the crystal block, they are all in line contact, and the contact area is large. As a result, the steel wire slips on the entry-cut surface. However, this cutting process cannot completely solve the phenomenon that the steel wire slips on the entry-cut surface. During the slicing process, the proportion of hidden cracks, thick slices, line marks, missing corners, and fragments is high. No lower, leading to a decrease in slicing yield, which seriously affects slicing efficiency

According to relevant reports, there is currently no effective way to solve these problems caused by this phenomenon in the industry at home and abroad

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