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Processing technology of golden finger

A processing technology, gold finger technology, applied in the direction of the formation of electrical connection of printing components, can solve the problem of easy to produce imprints and other problems, and achieve the effect of reducing the scrap rate and the surface imprinting of gold fingers

Inactive Publication Date: 2010-12-15
CHANGZHOU ZIYIN ELECTRONICS CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the disadvantage that the existing gold finger processing technology is easy to produce imprints, the present invention provides a gold finger processing technology

Method used

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  • Processing technology of golden finger
  • Processing technology of golden finger

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Embodiment Construction

[0012] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0013] Such as figure 1 It is a process flow chart of the present invention, a golden finger processing technology, including the following steps: selecting copper material → preliminary cleaning → polishing → chemical micro-etching → deep cleaning → drying → pattern electroplating → gold finger electroplating.

[0014] In the preliminary cleaning step, the surface of the copper is dedusted first, and then cleaned with detergent.

[0015] In the grinding step, the copper material is ground with No. 40 sandpaper, the stubborn dirt layer and oxide layer on the surface of the copper material are broken, and a frosted surface is formed on the surface of the coppe...

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Abstract

The invention relates to the technical field of hardware circuit design and manufacture, in particular to a processing technology of a golden finger. The processing technology comprises the following steps: copper selection, initial cleaning, polishing, chemical micro-etching, deep cleaning, drying, pattern plating and plating of the golden finger. In the step of the initial cleaning, the surface dedusting is firstly carried out on copper, and then a detergent is adopted for cleaning. In the polishing step, No.40 sand paper is adopted for polishing the copper, thereby breaking a stubborn dirt layer and an oxide layer on the surface of the copper and forming the matte surface on the surface of the copper. The matte surface is formed on the surface of the golden finger processed through the technology, thereby effectively reducing the production of imprints on the surface of the golden finger during the production test or the use, and greatly reducing the scrappage rate.

Description

technical field [0001] The invention relates to the technical field of hardware circuit design and manufacture, in particular to a golden finger processing technology. Background technique [0002] Gold finger connection is a commonly used hardware connection method in the computer hardware industry, such as memory sticks, PC boards, etc., all adopt this method, that is, directly make some pads on the PCB board, and then directly insert the PCB into the connector Go, there are spring tabs in the connector that snap into the pads to ensure electrical contact. At present, the surface treatment methods of gold finger on PCB include brush grinding method and chemical plating method. The surface appearance of gold fingers processed by grinding and electroless plating is bright, and any slight scratches during production and testing will produce very obvious marks. Contents of the invention [0003] In order to overcome the disadvantage that the existing golden finger processi...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 朱杰
Owner CHANGZHOU ZIYIN ELECTRONICS CIRCUIT
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