Processing technology of golden finger

A processing technology, gold finger technology, applied in the direction of the formation of electrical connection of printing components, can solve the problem of easy to produce imprints and other problems, and achieve the effect of reducing the scrap rate and the surface imprinting of gold fingers

Inactive Publication Date: 2010-12-15
CHANGZHOU ZIYIN ELECTRONICS CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the disadvantage that the existing gold finger processing technology

Method used

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  • Processing technology of golden finger
  • Processing technology of golden finger

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[0012] The present invention will now be described in further detail with reference to the drawings. These drawings are all simplified schematic diagrams, which merely illustrate the basic structure of the present invention in a schematic manner, so they only show the structures related to the present invention.

[0013] Such as figure 1 It is the process flow chart of the present invention, a gold finger processing process, including the following steps: selecting copper material→preliminary cleaning→polishing→chemical microetching→deep cleaning→drying→graphic plating→gold finger plating.

[0014] In the preliminary cleaning step, the surface of the copper material is first dedusted, and then detergent is used for cleaning.

[0015] In the polishing step, the copper material is polished with No. 40 sandpaper to break the stubborn dirt layer and oxide layer on the surface of the copper material, and form a matte surface on the surface of the copper material.

[0016] In the chemical ...

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Abstract

The invention relates to the technical field of hardware circuit design and manufacture, in particular to a processing technology of a golden finger. The processing technology comprises the following steps: copper selection, initial cleaning, polishing, chemical micro-etching, deep cleaning, drying, pattern plating and plating of the golden finger. In the step of the initial cleaning, the surface dedusting is firstly carried out on copper, and then a detergent is adopted for cleaning. In the polishing step, No.40 sand paper is adopted for polishing the copper, thereby breaking a stubborn dirt layer and an oxide layer on the surface of the copper and forming the matte surface on the surface of the copper. The matte surface is formed on the surface of the golden finger processed through the technology, thereby effectively reducing the production of imprints on the surface of the golden finger during the production test or the use, and greatly reducing the scrappage rate.

Description

technical field [0001] The invention relates to the technical field of hardware circuit design and manufacture, in particular to a golden finger processing technology. Background technique [0002] Gold finger connection is a commonly used hardware connection method in the computer hardware industry, such as memory sticks, PC boards, etc., all adopt this method, that is, directly make some pads on the PCB board, and then directly insert the PCB into the connector Go, there are spring tabs in the connector that snap into the pads to ensure electrical contact. At present, the surface treatment methods of gold finger on PCB include brush grinding method and chemical plating method. The surface appearance of gold fingers processed by grinding and electroless plating is bright, and any slight scratches during production and testing will produce very obvious marks. Contents of the invention [0003] In order to overcome the disadvantage that the existing golden finger processi...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 朱杰
Owner CHANGZHOU ZIYIN ELECTRONICS CIRCUIT
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