Component mounting condition determination method
A component and condition technology, applied in the field of component installation condition determination, to achieve the effect of improving throughput
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no. 1 example
[0134] Hereinafter, a first embodiment according to the present invention will be described in detail with reference to the drawings.
[0135] figure 1 is an external view of the configuration of the component mounting system 10 implementing the component mounting condition determining method according to the present invention.
[0136] The component mounting system 10 is a production line for mounting components on boards to produce circuit boards, and includes a mounting condition determination device 100 and a component mounter 200 (in figure 1 9 component mounters in the example of 200).
[0137] The mounting condition determining device 100 executes the component mounting condition determining method according to the present invention. This installation condition determination device 100 determines installation conditions to improve the throughput of the entire production line.
[0138] Each component mounter 200 included in the component mounting system 10 mounts comp...
no. 2 example
[0277] Next, a component mounting method according to the second embodiment will be described. Here, since the main constituent elements of the component mounting system 10 and the component mounter 200 according to the second embodiment are the same as in Figure 1-4 The elements of the first embodiment described in are the same as those of the first embodiment, and therefore description thereof is omitted.
[0278] Figure 15 is a block diagram showing the functional configuration of the component mounting condition determination device 100 according to the second embodiment.
[0279] The component mounting condition determining device 100 is a computer that executes processing such as determining mounting conditions so that the throughput of the entire production line can be improved. Component mounting condition determination apparatus 100 includes arithmetic control unit 101 , display unit 102 , input unit 103 , storage unit 104 , program storage unit 115 , communicatio...
no. 3 example
[0411]Next, a component mounting method according to a third embodiment will be described with reference to the drawings.
[0412] will refer to Figure 23 and 24 The configuration of the production line 1010 according to the third embodiment of the present invention will be described.
[0413] Figure 23 The appearance of the hardware configuration of the production line 1010 of the third embodiment is explained.
[0414] Such as Figure 23 As shown in , the production line 1010 includes component mounters 1100, 1200, and 1300 connected in the following order.
[0415] Component mounters 1100-1300 are the same type of component mounters and include 3 transfer conveyors. In other words, the production line 1010 includes 3 transfer lanes, which are transfer paths for mounting components on boards, so that it is possible for the production line 1010 to mount components on a maximum of 3 types of boards in parallel.
[0416] Figure 24 A top view of the lane configuration ...
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