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Packaging process for tire pressure monitoring device

A technology of tire pressure monitoring and packaging technology, which is applied to tire measurement, measurement devices, tire parts, etc., and can solve problems such as difficulty in achieving integration and large volume of tire pressure monitoring devices

Inactive Publication Date: 2010-12-29
GUANGDONG YUEJING HIGH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the tire pressure monitoring device prepared by the process in the prior art has a large volume, and it is difficult to achieve a higher degree of integration.

Method used

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  • Packaging process for tire pressure monitoring device
  • Packaging process for tire pressure monitoring device
  • Packaging process for tire pressure monitoring device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] A packaging process for a tire pressure monitoring device, such as figure 1 , figure 2 As shown, first prepare the following raw materials: metal lead frame 100, PCB board 200, MCU chip 300, RF chip 400, pressure sensor chip 500 and required packaging glue. The metal lead frame is provided with metal pins 110 , and the circuit layout is on the PCB board 200 .

[0044] After the above raw materials are prepared, the packaging process of the tire pressure monitoring device is carried out, which specifically includes the following steps:

[0045] A. Insulate and fix the PCB board 200 on the upper surface of the metal lead frame 100 .

[0046] B. Mount the MCU chip 300 and the RF chip 400 on the upper surface of the PCB 200 . The positions of the MCU chip 300 and the RF chip 400 on the upper surface of the PCB 200 are designed according to specific products. When mounting, the MCU chip 300 can be mounted first, and then the RF chip 400 can be mounted, or the RF chip 400...

Embodiment 2

[0059] A packaging process for a tire pressure monitoring device, such as figure 1 , figure 2 As shown, first prepare the following raw materials: metal lead frame 100, PCB board 200, MCU chip 300, RF chip 400, pressure sensor chip 500 and required packaging glue. The metal lead frame is provided with metal pins 110, and the PCB board 200 is provided with a circuit layout.

[0060] Specifically include the following steps:

[0061] A. Insulate and fix the PCB board 200 on the upper surface of the metal lead frame 100 .

[0062] B. Mount the MCU chip 300 and the RF chip 400 on the upper surface of the PCB 200 . The positions of the MCU chip 300 and the RF chip 400 on the upper surface of the PCB 200 are designed according to specific products. When mounting, the MCU chip 300 can be mounted first, and then the RF chip 400 can be mounted, or the RF chip 400 can be mounted first, and then the MCU chip 300 can be mounted.

[0063] C, MCU chip 300, RF chip 400 are connected wit...

Embodiment 3

[0076] Through the packaging process of a tire pressure monitoring device of the present invention, a tire pressure monitoring device suitable for a tire pressure monitoring system (TPMS) is prepared, such as Figure 5 , Figure 6 shown.

[0077] The shape of the tire pressure monitoring device is as follows: Figure 5 As shown, from the appearance, it has a shell, a metal cover 600 on the upper part of the shell, and exposed metal lead frame 100 pins. The metal cover 600 is provided with a through hole 610 .

[0078] The functions of each pin of the tire pressure monitoring device are shown in Table 1.

[0079] Table 1 Function table of each pin

[0080] pin

name

Function

1

PAOUT

Power amplifier output

2

IN2

Low frequency negative input

3

IN1

Low Frequency Positioning Input

4

GND

system grounding point

5

V2P

Sensor negative input 2

6

V2VSS

Negative Sensor Stimulation 2 ...

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Abstract

The invention relates to a packaging process for a tire pressure monitoring device, which comprises the following steps of: A, fixing a printed circuit board (PCB) on the upper surface of a metal lead frame; B, adhering an MCU chip and an RF chip to the upper surface of the PCB; C, connecting the MCU chip and the RF chip with the PCB and welding the MCU chip, the RF chip and the PCB with metal pins, or welding the MCU chip, the RF chip and the PCB with the metal pin and then connecting the MCU chip and the RF chip with the PCB; D, reserving a basic island and carrying out plastic packaging on the part of the metal lead frame except the basic island, the PCB, the MCU chip, the RF chip and leads; E, adhering a pressure sensor chip to the basic island; F, welding the pressure sensor chip with a metal pin of the basic island; G; packaging the pressure sensor chip; H, adhering a metal cover; and I, carrying out cutting forming to obtain a finished product. The product prepared by the invention has small volume and light weight.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a packaging process for a tire pressure monitoring device. Background technique [0002] TPMS (Tire Pressure Monitoring System) car tire pressure monitoring system is an ideal tool for real-time monitoring of changes in the air pressure in car tires. TPMS car tire pressure monitoring system is mainly to automatically monitor the air pressure in the tire when the car is running, and to give an alarm in time when the tire has air leakage or low air pressure, so as to ensure driving safety. At the same time, the TPMS system is used to monitor the tire pressure in real time, and when the tire pressure becomes low, it can be operated in time, so it can reduce the fuel consumption loss caused by driving when the tire pressure is low, and can prolong the service life of the tire. [0003] In the TPMS system, one of the most important devices is the tire pressure monitoring device. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B60C23/04G01L17/00
CPCH01L2224/48091H01L2224/48247H01L2924/1815
Inventor 邹仕和金玲黄钟坚梁志权沈文龙高子阳吕冬青仲镇华
Owner GUANGDONG YUEJING HIGH TECH CO LTD
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