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Printed circuit board

一种印刷电路板、集成电路的技术，应用在印刷电路、印刷电路、印刷电路制造等方向，能够解决损坏集成电路本身等问题

Inactive Publication Date: 2010-12-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the integrated circuit works at high speed, the high-frequency noise generated by the power supply terminal of the integrated circuit will reach the power layer through the via hole, thereby affecting other components on the printed circuit board, and even damaging the integrated circuit itself

Method used

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Examples

Experimental program
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Embodiment Construction

[0009] Please refer to figure 1 A preferred embodiment of the printed circuit board 10 of the present invention includes a first signal layer 100, a first reference layer (such as a power layer 200), a second reference layer (such as a ground layer 300), a second signal layer 400 . A first power supply via hole 510 , a second power supply via hole 520 and a ground via hole 530 . The power supply layer 200 is located below the first signal layer 100 , which is a power supply system of the printed circuit board 10 and is used for supplying power to components on the printed circuit board 10 . The ground layer 300 is located below the power layer 200 and above the second signal layer 400 . The first power via 510 , the second power via 520 and the ground via 530 are through holes penetrating the first signal layer 100 , the power layer 200 , the ground layer 300 and the second signal layer 400 . In this embodiment, between the first signal layer 100 and the power layer 200 , be...

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PUM

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Abstract

The invention relates to a printed circuit board, which comprises a first signal layer, a first reference layer, a second reference layer, a second signal layer, a first power source through hole and a second power source through hole. The first signal layer is provided with an integrated circuit and a first power wire. The second signal layer is provided with a capacitor and a second power wire. The second reference layer is provided with a hollow. The projection of the hollow on the second signal layer at least overlaps with the second power wire partially. The first power wire is connected with a power end of the integrated circuit and the first power source through hole. The second power wire is connected with the first power source through hole and the second power source through hole. One end of the capacitor is connected with the first power source through hole, while the other end is earthed. The printed circuit board causes most part of high-frequency noise generated at the power end to flow to the capacitor, and then the noise is also filtered by the capacitor, so that the high-frequency noise is reduced.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] An integrated circuit assembled on a printed circuit board usually has a power terminal and a ground terminal, and the power terminal and the ground terminal are respectively connected to the power layer and the ground layer of the printed circuit board through via holes. However, with the development of technology, integrated circuits are moving towards high frequency and high speed. When the integrated circuit works at high speed, the high-frequency noise generated by the power supply terminal of the integrated circuit will reach the power layer through the via hole, thereby affecting other components on the printed circuit board, and even damaging the integrated circuit itself. Contents of the invention [0003] In view of the above, it is necessary to provide a printed circuit board that reduces high frequency noise. [0004] A printed circuit board, comprising a fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/02H05K3/46
CPCH05K3/429H05K1/0231H05K2201/0969H05K1/0253H05K1/112H05K2201/10545H05K2201/10689
Inventor 许寿国陈俊仁
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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