Thermal print head and preparation method thereof

A technology of thermal print head and heating resistor, which is applied in printing and other directions, can solve the problem of high energy consumption of thermal print head, achieve the effect of reducing production cost, reducing energy loss, and hindering transmission

Inactive Publication Date: 2011-01-05
SHANDONG HUALING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the technical deficiency of high energy consumption of the existing thermal print head, and provide a new thermal print head and its production method, so as to reduce the energy loss of the thermal print head and meet the requirements for printing when the battery is driven. head low energy requirements

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  • Thermal print head and preparation method thereof
  • Thermal print head and preparation method thereof

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with accompanying drawing:

[0020] As shown in the figure: a thermal print head, including a substrate 30 made of insulating material, a partial or full underglaze layer is formed on the surface of the substrate 30, and a plurality of electrode wires 40 and a plurality of heating electrodes are arranged on the underglaze layer or the surface of the substrate 30. Resistor 50, electrode leads 40 are used to supply power to heating resistor 50, and protective layer 60 formed by thick film method or sputtering method is adopted on heating element resistor 50 and at least a part of electrode leads 40. The present invention is characterized in that substrate 30 An underglaze layer formed by an underglaze layer 10 and an overglaze layer 20 is provided, and bubbles are evenly distributed in the glaze layer to further reduce the thermal conductivity of the underglaze layer.

[0021] In the present invention, t...

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Abstract

The invention relates to the field of thermal printers, in particular to a thermal print head comprising a substrate made from an insulated material. A partial or full ground glaze layer is formed on the surface of the substrate, the surface of the ground glaze layer or the substrate is provided with a heating resistor body and an electrode lead, wherein the heating resistor body is powered through the electrode lead, and a protective layer covers at least one part of the heating resistor body and the electrode lead connected with the heating resistor body. The thermal print head is characterized in that the surface of the substrate is provided with the ground glaze layer comprising a lower glaze layer and an upper glaze layer which are evenly distributed with air bubbles and respectively made from glaze pulp with different softening point temperatures and high-temperature viscosities, the upper glaze layer is melted early than the lower glaze layer during sintering, and the melted upper glaze layer prevents gases generated during the sintering of lower glaze layer from emitting. In addition, the lower glaze layer adopts the glaze pulp with higher viscosity at a high temperature so that the gases in the lower glaze layer are hardly emitted during sintering, and the gases which are not emitted are kept and exist in the glaze layer in an air bubble mode. Accordingly, due to the existence of the air bubbles, the heat conductivity coefficient of the ground glaze layer is reduced, heat is prevented from transferring in the ground glaze layer, the energy loss is reduced and the energy-saving effect is achieved.

Description

technical field [0001] The invention relates to the field of thermal printers, in particular to a thermal print head capable of reducing heat loss and saving printing energy and a production method thereof. Background technique [0002] As we all know, under normal circumstances, the ceramic substrate of thermal print head (thermal print head) uses glaze slurry, and adopts the method of printing and sintering (hereinafter referred to as thick film method) to form an underglaze layer on the insulating substrate. Electrode wires are formed on the substrate by thick film method or spray plating, and heating resistors are formed on the underglaze layer by thick film method or spray plating, heating resistors and at least a part of the electrode wires connected to the heating resistors The protective layer is formed by thick film method or spray plating, and the thermal conductivity coefficient of the bottom glaze layer material is much smaller than that of the ceramic substrate,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/335B41J2/345
Inventor 王夕炜赵国建贺喆
Owner SHANDONG HUALING ELECTRONICS
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